UPSIREN
UPSIREN OEM Thermal Pad 21W/mK 100x100x3.0mm 23g
High-conductivity silicone pad measuring 100 x 100 x 3.0 mm with 21 W/mK rating for CPU, GPU and LED cooling
- Volume / Net Weight23g
- Thermal Conductivity21W/mk
- Long Term Operating Temperature-40 to 200 C
- FeaturesNon-Corrosive, Non-Curing & Non-Toxi
Option 100 x 100 x 3.0 mm
- 100 x 100 x 3.0 mm
- 100 x 100 x 0.5 mm
- 100 x 100 x 2.0 mm
- 100 x 100 x 1.5 mm
- 100 x 100 x 1.0 mm
- 100*100*2.5mm
- High conductivity at 21W/mK for efficient heat transfer
- Soft 30-degree pad compresses to fit chips tightly
- Non-conductive silicone prevents electrical shorts safely
- Operates from -40 to 200°C without melting
- Reusable pad with natural viscosity eases assembly
High-conductivity silicone thermal pad
This UPSIREN OEM pad measures 100 by 100 by 3.0 millimetres and weighs 23 grams. It carries a rated thermal conductivity of 21 W/mK and a long-term operating range of minus 40 to 200 degrees Celsius. The silicone material is non-conductive, non-corrosive, non-curing and non-toxic. Natural viscosity lets it seat easily and be reused.
Builders filling larger gaps on GPUs.
The 3.0 millimetre thickness suits interfaces where a standard paste layer is too thin and a thinner pad leaves voids. Users needing a sub-millimetre bond line or a liquid metal compound should choose a different format. The pad’s 30-degree shore hardness gives a soft, compressible feel that conforms to uneven surfaces without excessive pressure.
Steady heat transfer across the full temperature
Rated conductivity holds from minus 40 up to 200 degrees Celsius without melting or curing, so sustained loads do not degrade the interface. Non-curing silicone avoids pump-out over thermal cycles, keeping contact pressure stable. Electrical insulation remains intact at high temperature, preventing shorts on exposed PCB traces.
Besonderheiten
- High conductivity at 21W/mK for efficient heat transfer
- Soft 30-degree pad compresses to fit chips tightly
- Non-conductive silicone prevents electrical shorts safely
- Operates from -40 to 200°C without melting
- Reusable pad with natural viscosity eases assembly
Technische Daten
| Brand | UPSIREN |
|---|---|
| Series | OEM |
| Model | 21W |
| Volume / Net Weight | 23g |
| Thermal Conductivity | 21W/mk |
| Long Term Operating Temperature | -40 to 200 C |
| Features | Non-Corrosive, Non-Curing & Non-Toxi |
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Fragen zu diesem Artikel
What surface area must the heatsink or component cover to use the full 100x100mm pad?
The pad measures 100 by 100 millimetres, so the mating surface should be at least that large to utilise the entire piece.
Will the 3.0mm thickness and 30-degree hardness still compress properly against a legacy GPU or CPU with uneven surfaces?
At 3.0 millimetres thick and 30 degrees hardness the material is soft and compressible, allowing it to conform to irregular gaps on older chips.
How can I verify the pad is performing at its rated 21 W/mK conductivity once installed?
Monitor component temperatures under load; a drop toward the expected thermal resistance for 21 W/mK material indicates the pad is working as intended.
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