UPSIREN
UPSIREN OEM 21W/mK Thermal Pad 100x100x2.0mm 23g
A 21 W/mK silicone thermal pad measuring 100 × 100 × 2.0 mm, non-conductive and rated from -40 °C to 200 °C
- Volume / Net Weight23g
- Thermal Conductivity21W/mk
- Long Term Operating Temperature-40 to 200 C
- FeaturesNon-Corrosive, Non-Curing & Non-Toxi
Option 100 x 100 x 2.0 mm
- 100 x 100 x 3.0 mm
- 100 x 100 x 0.5 mm
- 100 x 100 x 2.0 mm
- 100 x 100 x 1.5 mm
- 100 x 100 x 1.0 mm
- 100*100*2.5mm
- High 21 W/mK conductivity moves heat fast
- 100 x 100 x 2.0 mm size fits many chips
- Non-conductive silicone prevents electrical shorts
- Soft 30-degree hardness compresses for tight contact
- Operates from -40 to 200 °C without melting
Purpose-built thermal interface
The UPSIREN OEM pad is a 100 by 100 millimetre silicone sheet with a 2.0 millimetre thickness and a rated thermal conductivity of 21 watts per metre kelvin. It targets builders and repair technicians who need a non-conductive, non-corrosive gap filler for CPU, GPU, laptop heatsink or LED cooler installations. The material stays pliable from minus 40 to 200 degrees Celsius and weighs 23 grams per pad.
Reusable convenience without paste mess
Unlike thermal grease, the pad requires no spreading, curing time or cleanup and can be lifted and repositioned during assembly. Its natural viscosity holds components in place while the 30-degree Shore hardness lets it compress to match uneven surfaces. The non-toxic, odourless formulation eliminates electrical shorts and avoids metal corrosion, making it safe for dense PCB areas.
Durable insulation for repeated service
The silicone construction resists drying, cracking and static buildup, so the pad survives multiple disassembly cycles without losing performance. Fire-retardant and anti-corrosion properties extend service life in automotive, industrial and consumer electronics environments. The 100 by 100 millimetre format can be trimmed to smaller footprints, giving installers a single stock item for varied chip sizes.
Besonderheiten
- High 21 W/mK conductivity moves heat fast
- 100 x 100 x 2.0 mm size fits many chips
- Non-conductive silicone prevents electrical shorts
- Soft 30-degree hardness compresses for tight contact
- Operates from -40 to 200 °C without melting
Technische Daten
| Brand | UPSIREN |
|---|---|
| Series | OEM |
| Model | 21W |
| Volume / Net Weight | 23g |
| Thermal Conductivity | 21W/mk |
| Long Term Operating Temperature | -40 to 200 C |
| Features | Non-Corrosive, Non-Curing & Non-Toxi |
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Fragen zu diesem Artikel
Does the 21W/mK thermal pad degrade or need replacement over time?
The pad is non-curing and non-corrosive, so it will not dry out or degrade; it remains reusable and effective across the -40 to 200°C operating range without scheduled replacement.
What limits continuous cooling performance at the 21W/mK rating?
The 30-degree Shore hardness lets the pad compress and conform to surfaces, but thermal transfer is ultimately capped by the 21W/mK conductivity figure and the 2.0mm thickness.
How much heat or power does the pad itself generate during all-day operation?
The silicone pad is passive — it produces no heat or power draw; it simply conducts heat up to its 21W/mK rating while staying stable from -40 to 200°C.
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