NEMIX RAM DDR5-5600 2TB (16x128GB) ECC RDIMM CL46 1.1V Supermicro H14SST-G memory upgrade
- 2TB (16 x 128GB)
- 288-Pin DDR5 RDIMM
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AMD
32-core server processor with 64 threads, 2.35 GHz base and 3.35 GHz boost, 128 MB L3 cache, eight-channel DDR4-3200 support and 128 lanes of PCIe 4.0 in a 155 W SP3 package
The AMD EPYC 7452 delivers 32 cores and 64 threads at a 2.35 GHz base frequency with a 3.35 GHz max turbo. It fits the Socket SP3 platform and provides 128 lanes of PCI Express 4.0 connectivity. This processor targets virtualisation hosts, cloud nodes and high-performance computing clusters that need high core counts.
Thermal design power is rated at 155 W, so a compatible SP3 cooler or liquid loop must be sourced separately. The 7 nm process helps efficiency, but sustained all-core loads will still demand substantial airflow. Eight-channel DDR4-3200 memory support spreads bandwidth across many modules, reducing per-channel pressure.
The unit ships in OEM packaging without a heatsink, fan or mounting hardware. No software licence or management utility is bundled. System integrators must provide their own cooling solution and rely on platform firmware for features such as AMD Infinity Guard security. Memory and storage are not included.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 7002 |
| Name | EPYC 7452 |
| Model | 100-000000057 |
| CPU Socket Type | Socket SP3 |
| # of Cores | 32-Core |
| # of Threads | 64 |
| Operating Frequency | 2.35 GHz |
| Max Turbo Frequency | 3.35 GHz |
| L3 Cache | 128MB |
| 64-Bit Support | Yes |
| Integrated Memory Controller Speed | DDR4 3200 |
| Memory Channel | 8 Channel |
| PCI Express Revision | 4.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 155W |
| Cooling Device | Cooling device not included - Processor Only |
| Forsendelsesvægt | 1.95 kg |
| Pakkestørrelse | 203 × 127 × 76 mm |
The processor seats in the SP3 LGA socket without soldering; the step often missed is following the manufacturer's specified torque sequence for the retention frame to ensure even contact pressure.
The processor itself requires no scheduled maintenance; plan to replace the separate cooling solution's thermal interface material every few years and verify fan operation, as no cooler is included in the box.
The 155 W thermal envelope is the first constraint; the cooling solution must dissipate this heat continuously or the processor will reduce clocks below the 2.35 GHz base frequency to stay within its thermal design power.
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