NEMIX RAM DDR5-5600 2TB (16x128GB) ECC RDIMM CL46 1.1V Supermicro H14SST-G memory upgrade
- 2TB (16 x 128GB)
- 288-Pin DDR5 RDIMM
Vi tager imod kryptovaluta — så den krypto, du ejer, kan købe rigtig hardware.Betal med krypto, brug det på rigtig hardware. Gratis, forsikret levering til hele verden ved køb over 399 $. Neutrale, umærkede papkasser, sendt fra Tyskland.Gratis, forsikret levering over 399 $. Din kurs låses i 30 minutter, så snart kassen åbner.Kurs låst i 30 minutter. Hver vare er forseglet, har kontrolleret serienummer og er dækket af 24 måneders garanti.Forseglet, 24 måneders garanti.
AMD
32-core server processor with 2.8 GHz base clock, 3.7 GHz max turbo, 256 MB L3 cache and 128 PCIe 4.0 lanes
The AMD EPYC 7543 is a 32-core, 64-thread server processor built on the Milan architecture. It runs at a 2.8 GHz base clock and boosts to 3.7 GHz with a 256 MB L3 cache. The chip fits Socket SP3 platforms and supports eight-channel DDR4-3200 memory alongside 128 lanes of PCIe 4.0.
This processor targets virtualisation hosts, database clusters, and compute-intensive HPC nodes that benefit from high core counts and large cache. Its 225 W TDP and active cooling requirement rule it out for passively cooled edge appliances or space-constrained 1U systems with limited thermal headroom.
The 256 MB L3 cache is the specification that determines whether this part matches the workload. Applications with large working sets — such as in-memory databases or large-scale simulation — see reduced latency and higher throughput when the dataset fits in cache; smaller working sets gain less from the extra capacity.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 7003 |
| Name | EPYC 7543 |
| Model | 100-000000345 |
| CPU Socket Type | Socket SP3 |
| Core Name | Milan |
| # of Cores | 32-Core |
| # of Threads | 64 |
| Operating Frequency | 2.8 GHz |
| Max Turbo Frequency | 3.7 GHz |
| L3 Cache | 256MB |
| 64-Bit Support | Yes |
| Manufacturing Tech | 7 nm |
| Integrated Memory Controller Speed | DDR4 3200 |
| Memory Channel | 8 Channel |
| Virtualization Technology Support | Yes |
| PCI Express Revision | 4.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 225W |
| Cooling Device | Cooling device not included - Processor Only |
| Forsendelsesvægt | 0.82 kg |
| Pakkestørrelse | 152 × 152 × 102 mm |
It fits a Socket SP3 platform and has a 225 W thermal design power, so the board and cooler must support that socket and wattage.
The CPU drops into the SP3 LGA socket; the critical step is applying a server-grade cooler rated for 225 W, because no cooling device is included in the box.
Plan to replace thermal paste every two to three years and keep heatsink fins free of dust so the 225 W TDP stays within safe temperatures.
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