AMD EPYC 9174F 16-Core 4.1 GHz Server Processor 100-000000796
- EPYC 9174F
- Socket SP5
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AMD
48-core server CPU running at 3.6 GHz with a 4.1 GHz boost, 256 MB L3 cache and 128 PCIe 5.0 lanes for dense compute workloads
Option EPYC 9474F
The AMD EPYC 9474F is a 48-core server processor built for Socket SP5 platforms. It runs at a 3.6 GHz base frequency with a 4.1 GHz max turbo and provides 96 threads for heavy parallel workloads. The chip combines 48 MB of L2 cache with 256 MB of L3 cache to keep large data sets close to the cores.
This processor fits workloads that scale across many cores such as virtualization hosts, database nodes and scientific simulations. The 12-channel DDR5 4800 memory controller and 128 lanes of PCI Express 5.0 give ample bandwidth for memory-heavy and I/O-heavy deployments. Buyers who need a lower thermal envelope or fewer cores should consider other SKUs in the same generation.
The 360 W thermal design power means the system must provide robust cooling and power delivery; no cooler is included in the box. The Socket SP5 interface and 12-channel DDR5 4800 support are fixed requirements — the motherboard must match both exactly. Verify that your chassis, power supply and firmware can sustain 360 W before selecting this part.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 9004 |
| Name | EPYC 9474F |
| Model | 100-000000788 |
| CPU Socket Type | Socket SP5 |
| # of Cores | 48-Core |
| # of Threads | 96 |
| Operating Frequency | 3.6 GHz |
| Max Turbo Frequency | 4.1 GHz |
| L3 Cache | 256MB |
| 64-Bit Support | Yes |
| Integrated Memory Controller Speed | DDR5 4800 |
| Memory Channel | 12 Channel |
| PCI Express Revision | 5.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 360W |
| Cooling Device | Cooling device not included - Processor Only |
| Forsendelsesvægt | 2.27 kg |
| Pakkestørrelse | 25 × 25 × 25 mm |
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The processor fits Socket SP5 and has a 360 W thermal design power, so the motherboard must provide SP5 mounting and a VRM rated for at least 360 W sustained load.
Open the SP5 load plate, align the triangle marker on the 9474F with the socket key, lower the chip without pressure, close the load plate and torque the retention screws in the prescribed sequence; the step most often missed is the ordered torque sequence, which prevents uneven contact.
With no bundled cooler, you must monitor the 360 W heat output through the platform’s thermal sensors, keep the heatsink fins and fan paths clear of dust, and reapply thermal paste if temperatures rise above the normal operating envelope.
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