NEMIX RAM DDR5-5600 2TB (16x128GB) ECC RDIMM CL46 1.1V Supermicro H14SST-G memory upgrade
- 2TB (16 x 128GB)
- 288-Pin DDR5 RDIMM
Vi tager imod kryptovaluta — så den krypto, du ejer, kan købe rigtig hardware.Betal med krypto, brug det på rigtig hardware. Gratis, forsikret levering til hele verden ved køb over 399 $. Neutrale, umærkede papkasser, sendt fra Tyskland.Gratis, forsikret levering over 399 $. Din kurs låses i 30 minutter, så snart kassen åbner.Kurs låst i 30 minutter. Hver vare er forseglet, har kontrolleret serienummer og er dækket af 24 måneders garanti.Forseglet, 24 måneders garanti.
ASUS
LGA 1155 Micro ATX board with Intel Z77 chipset supporting 32GB DDR3 memory
The ASUS P8Z77-M is a Micro ATX motherboard built on the Intel Z77 chipset with an LGA 1155 socket. It supports DDR3 memory up to 32GB maximum capacity. This board suits builders assembling a compact system around a compatible Intel processor.
The Z77 chipset and LGA 1155 platform deliver typical power draw for their class with standard air cooling. Normal operation remains quiet with adequate case airflow. The 32GB memory ceiling helps contain total system power within expected limits.
Micro ATX dimensions fit smaller chassis while retaining essential expansion slots. The package includes one SATA cable and a chassis I/O back panel for immediate installation. Note that the unit ships without original packaging and includes only the motherboard, metal battery, and SATA cable. Buyers needing additional accessories or original boxing should look elsewhere.
| Brand | ASUS |
|---|---|
| Model | ASUS P8Z77-M |
| CPU Socket Type | LGA 1155 |
| Chipset | Intel Z77 |
| Maximum Memory Supported | 32GB |
Mount the board using the Micro ATX screw pattern, fit the supplied I/O back panel before securing the board, then install an LGA 1155 processor and DDR3 modules up to 32GB total. The step many miss is fitting the I/O shield first; it cannot be added after the board is screwed down.
The onboard CMOS battery (supplied as a metal cell) will eventually lose charge and should be swapped when BIOS settings stop retaining. Apart from that, the board has no user-serviceable parts; just keep the CPU socket and DDR3 slots free of dust.
The Intel Z77 chipset and VRM area are the first thermal bottlenecks during extended heavy workloads. Adequate case airflow over the heatsinks is essential to prevent throttling, especially with a 77 W-class LGA 1155 CPU at full boost.
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