NEMIX RAM DDR5-5600 2TB (16x128GB) ECC RDIMM CL46 1.1V Supermicro H14SST-G memory upgrade
- 2TB (16 x 128GB)
- 288-Pin DDR5 RDIMM
Vi tager imod kryptovaluta — så den krypto, du ejer, kan købe rigtig hardware.Betal med krypto, brug det på rigtig hardware. Gratis, forsikret levering til hele verden ved køb over 399 $. Neutrale, umærkede papkasser, sendt fra Tyskland.Gratis, forsikret levering over 399 $. Din kurs låses i 30 minutter, så snart kassen åbner.Kurs låst i 30 minutter. Hver vare er forseglet, har kontrolleret serienummer og er dækket af 24 måneders garanti.Forseglet, 24 måneders garanti.
ASUS
ATX motherboard for AMD Ryzen 7000, 8000 and 9000 series with 14+2+2 80A power stages, DDR5 AEMP, 2.5G LAN and WiFi 7
This ATX motherboard uses the AMD B850 chipset and an AM5 socket supporting Ryzen 7000, 8000 and 9000 series desktop processors. It delivers a 14+2+2 power stage design rated for 80A per stage with dual 8-pin ProCool connectors, substantial VRM heatsinks linked by thermal pads, and an integrated I/O cover. Connectivity includes WiFi 7 with a Q-Antenna, 2.5G LAN, USB 20Gbps Type-C, and four M.2 slots.
The board suits builders who want four M.2 sockets — one PCIe 5.0 and three PCIe 4.0 — all with dedicated cooling, plus WiFi 7 and 2.5G LAN in a single ATX package. It also fits users who value AI-assisted setup through ASUS AI Advisor and AI Networking II. Buyers who require more than four M.2 sockets or a different wireless standard should consider other options.
Four DIMM slots accept up to 256GB of DDR5 and support speeds beyond 8000 MT/s when overclocked with compatible Ryzen 7000, 8000 or 9000 series CPUs. ASUS Enhanced Memory Profile (AEMP) and AMD EXPO profiles simplify memory tuning for higher data rates. This memory ceiling is the key figure to verify against your chosen processor and kit.
Der er endnu ikke offentliggjort specifikationer for denne vare.
Lift the retention arm, align the triangle on the processor with the socket corner, place it gently without pressure, then lower and lock the arm; the common mistake is pressing the chip down before the arm is fully secured.
The massive heatsinks use high-conductivity thermal pads between the VRMs and the fin stack; after several years the pads can dry out, so replacing them with fresh pads of the same thickness restores full thermal transfer.
Each stage is rated for 80A, so the VRM thermal capacity of the bridged heatsink array becomes the limiting factor before the electrical rating is reached during prolonged all-core workloads.
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