GELID SOLUTIONS
GELID SOLUTIONS TC-GC-04-A thermal paste 7.0g 4.5 W/mK
High-conductivity 4.5 W/mK thermal compound in a 7.0 g syringe for efficient CPU and GPU heat transfer
- Volume / Net Weight7.0g
- FeaturesNo Irritation to Human Skin Optimal Heat Conductivity Non-El
- High thermal conductivity rated above 4.5 W/mK for efficient heat transfer
- Easy application with ultra-fine nano molecular structure filling microscopic gaps effectively
- Safe non-electrically conductive formula prevents short circuits on components
- Stable non-volatile non-toxic composition ensures long-lasting performance without degradation
- 0 g syringe provides sufficient compound for multiple CPU or GPU installations
High-conductivity thermal compound
GC-Supreme thermal compound uses nano-scale molecular structure to fill microscopic gaps between CPU or GPU and cooler. The 7.0 g syringe delivers enough material for multiple applications on desktop or laptop processors. Its non-electrically conductive formula eliminates the risk of short circuits if excess paste spreads onto surrounding components.
Thermal conductivity above 4.5 W/mK
This single figure determines whether the paste can move heat quickly enough for your cooling solution. At >4.5 W/mK the compound suits mainstream and enthusiast air coolers as well as all-in-one liquid loops. Lower-conductivity pastes would create a bottleneck that raises core temperatures under the same workload.
Stable viscosity under sustained load
Rated at 250000 centipoise, the grease resists pump-out and dry-out during long rendering, compile or gaming sessions. Density of 2.55 g/cm³ keeps the layer uniform without separating over time. Non-volatile and non-toxic composition means performance remains consistent without degradation or safety concerns.
Fordele
- High thermal conductivity rated above 4.5 W/mK for efficient heat transfer
- Easy application with ultra-fine nano molecular structure filling microscopic gaps effectively
- Safe non-electrically conductive formula prevents short circuits on components
- Stable non-volatile non-toxic composition ensures long-lasting performance without degradation
- 0 g syringe provides sufficient compound for multiple CPU or GPU installations
Specifikationer
| Brand | GELID Solutions |
|---|---|
| Model | TC-GC-04-A |
| Volume / Net Weight | 7.0g |
| Features | No Irritation to Human Skin Optimal Heat Conductivity Non-Electrical Conductive Non-Flammable Anti-Oxidation & Non-Corrosive Non-Volatile & Non-Toxic Density (g/cm3): 2.55 Net Content (g): 7 Thermal Conductivity (W/mK): >4.5 Viscosity (Centipoise): 250000 |
| Forsendelsesvægt | 0.01 kg |
| Pakkestørrelse | 169 × 119 × 23 mm |
Spørgsmål om denne vare
What does 4.5 W/mK thermal conductivity mean once the paste is applied between CPU and cooler?
The 4.5 W/mK rating indicates how efficiently heat moves through the compound; in a real machine it helps keep the processor closer to the cooler temperature under load.
Is there any electrical conductivity or safety standard that limits where I can use this compound?
The paste is non-electrically conductive, non-flammable, non-toxic and non-corrosive, so it can be used on exposed circuits without risk of shorting or damage.
How much area can the 7.0 g syringe cover and what mounting pressure does it need?
Seven grams typically covers multiple CPU applications; the 250,000 cP viscosity means it spreads evenly under normal cooler mounting pressure without requiring extra force.
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