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White 7.0g syringe of thermal compound with applicator tip

GELID SOLUTIONS

GELID SOLUTIONS TC-GC-04-A thermal paste 7.0g 4.5 W/mK

SKU CH-EVAE-5EXH0 MPN TC-GC-04-A

High-conductivity 4.5 W/mK thermal compound in a 7.0 g syringe for efficient CPU and GPU heat transfer

  • Volume / Net Weight7.0g
  • FeaturesNo Irritation to Human Skin Optimal Heat Conductivity Non-El
  • High thermal conductivity rated above 4.5 W/mK for efficient heat transfer
  • Easy application with ultra-fine nano molecular structure filling microscopic gaps effectively
  • Safe non-electrically conductive formula prevents short circuits on components
  • Stable non-volatile non-toxic composition ensures long-lasting performance without degradation
  • 0 g syringe provides sufficient compound for multiple CPU or GPU installations

High-conductivity thermal compound

GC-Supreme thermal compound uses nano-scale molecular structure to fill microscopic gaps between CPU or GPU and cooler. The 7.0 g syringe delivers enough material for multiple applications on desktop or laptop processors. Its non-electrically conductive formula eliminates the risk of short circuits if excess paste spreads onto surrounding components.

Thermal conductivity above 4.5 W/mK

This single figure determines whether the paste can move heat quickly enough for your cooling solution. At >4.5 W/mK the compound suits mainstream and enthusiast air coolers as well as all-in-one liquid loops. Lower-conductivity pastes would create a bottleneck that raises core temperatures under the same workload.

Stable viscosity under sustained load

Rated at 250000 centipoise, the grease resists pump-out and dry-out during long rendering, compile or gaming sessions. Density of 2.55 g/cm³ keeps the layer uniform without separating over time. Non-volatile and non-toxic composition means performance remains consistent without degradation or safety concerns.

Najważniejsze cechy

  • High thermal conductivity rated above 4.5 W/mK for efficient heat transfer
  • Easy application with ultra-fine nano molecular structure filling microscopic gaps effectively
  • Safe non-electrically conductive formula prevents short circuits on components
  • Stable non-volatile non-toxic composition ensures long-lasting performance without degradation
  • 0 g syringe provides sufficient compound for multiple CPU or GPU installations

Specyfikacja

BrandGELID Solutions
ModelTC-GC-04-A
Volume / Net Weight7.0g
FeaturesNo Irritation to Human Skin
Optimal Heat Conductivity
Non-Electrical Conductive
Non-Flammable
Anti-Oxidation & Non-Corrosive
Non-Volatile & Non-Toxic
Density (g/cm3): 2.55
Net Content (g): 7
Thermal Conductivity (W/mK): >4.5
Viscosity (Centipoise): 250000
Waga przesyłki0.01 kg
Wymiary opakowania169 × 119 × 23 mm

Pytania dotyczące tego produktu

What does 4.5 W/mK thermal conductivity mean once the paste is applied between CPU and cooler?

The 4.5 W/mK rating indicates how efficiently heat moves through the compound; in a real machine it helps keep the processor closer to the cooler temperature under load.

Is there any electrical conductivity or safety standard that limits where I can use this compound?

The paste is non-electrically conductive, non-flammable, non-toxic and non-corrosive, so it can be used on exposed circuits without risk of shorting or damage.

How much area can the 7.0 g syringe cover and what mounting pressure does it need?

Seven grams typically covers multiple CPU applications; the 250,000 cP viscosity means it spreads evenly under normal cooler mounting pressure without requiring extra force.

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