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Intel Xeon 5218 server CPU, silver heat spreader, gold contact pads, rectangular Socket 3647 form factor

HPE

HPE P02592B21 Xeon 5218 16-core 2.30 GHz server processor

SKU CH-TZCN-5ZXMB MPN P02592B21

16-core Intel Xeon processor running at 2.30 GHz with 22 MB L3 cache, 125 W TDP and Socket 3647 for HPE ProLiant DL360 Gen10 servers

  • 16 cores handle parallel workloads
  • 30 GHz base clock with 3.90 GHz turbo boost
  • 22 MB L3 cache reduces data latency
  • 125 W TDP fits standard server cooling
  • Socket 3647 for HPE ProLiant DL360 Gen10 compatibility

HPE Xeon 5218 16-core server processor

This HPE kit delivers an Intel Xeon 5218 processor with sixteen cores running at 2.30 GHz and a 3.90 GHz turbo frequency. It fits the Socket 3647 platform and includes 22 MB of L3 cache. The 125 W thermal design power suits dense rack deployments.

Suits DL360 Gen10 upgrades; not for other sockets

The processor is validated for HPE ProLiant DL360 Gen10 servers. Builders targeting different chassis, other socket types, or lower power envelopes should look elsewhere. The 14 nm architecture supports 64-bit workloads in compatible systems.

Socket 3647 compatibility decides fit

This CPU installs only in motherboards wired for Socket 3647 with appropriate BIOS support. The 125 W TDP and 87 °C thermal spec require matching cooling. Verify the server model before purchase.

Fordele

  • 16 cores handle parallel workloads
  • 30 GHz base clock with 3.90 GHz turbo boost
  • 22 MB L3 cache reduces data latency
  • 125 W TDP fits standard server cooling
  • Socket 3647 for HPE ProLiant DL360 Gen10 compatibility

Specifikationer

BrandHPE - PROLIANT SERVERS
Forsendelsesvægt2.27 kg
Pakkestørrelse297 × 188 × 175 mm

Spørgsmål om denne vare

Will the 3-inch wide by 2.2-inch deep Socket 3647 package fit my HPE ProLiant DL360 Gen10 server?

The processor uses the Socket 3647 interface and measures 3 inches wide by 2.2 inches deep, matching the DL360 Gen10 socket and chassis clearance.

What is the correct way to seat the 16-core Xeon 5218 in the LGA 3647 socket without bending pins?

Align the notches on the processor with the socket keys, lower it vertically without force, then engage the load-plate lever fully; the most common error is tilting the chip during insertion.

When should I plan to replace the thermal interface material on this 125 W TDP processor?

Replace the thermal paste whenever the cooler is removed or if temperatures approach the 87 °C thermal specification under sustained load.

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