NEMIX RAM DDR5-5600 2TB (16x128GB) ECC RDIMM CL46 1.1V Supermicro H14SST-G memory upgrade
- 2TB (16 x 128GB)
- 288-Pin DDR5 RDIMM
Vi tager imod kryptovaluta — så den krypto, du ejer, kan købe rigtig hardware.Betal med krypto, brug det på rigtig hardware. Gratis, forsikret levering til hele verden ved køb over 399 $. Neutrale, umærkede papkasser, sendt fra Tyskland.Gratis, forsikret levering over 399 $. Din kurs låses i 30 minutter, så snart kassen åbner.Kurs låst i 30 minutter. Hver vare er forseglet, har kontrolleret serienummer og er dækket af 24 måneders garanti.Forseglet, 24 måneders garanti.
Intel
A matched pair of 10-core Xeon Silver 4114 processors running at 2.20 GHz with 13.75 MB L3 cache for ThinkSystem SR530, SR630, SR650 and ST550 servers
This pack contains two Intel Xeon Silver 4114 processors, each with 10 cores running at a base frequency of 2.20 GHz and a turbo frequency of 3.00 GHz. They are validated for ThinkSystem SR530, SR630, SR650 and ST550 servers. The matched pair suits administrators scaling out compute density in these specific platforms. Buyers needing a single CPU or a different socket type cannot use this kit.
Each processor operates at a thermal design power of 85 W. The supplier notes that the bundled thermal compound will not separate, run, migrate or bleed during normal operation. This characteristic helps maintain consistent thermal transfer between the die and the heatsink over time. Systems without adequate airflow for 85 W per socket may throttle under sustained load.
The memory controller supports up to 768 GB of DDR4-2400 across a maximum of six channels per processor. This capacity ceiling enables large virtualisation host deployments or in-memory databases within the supported ThinkSystem chassis. Workloads requiring faster memory speeds or greater than 768 GB per socket must consider alternative platforms.
| CPU Socket Type | Slot 2 |
|---|
Align each processor with the Slot 2 keying, seat it firmly until the retention latch clicks, then apply the included thermal paste in a thin, even layer before mounting the heatsink — skipping the paste or using too much is the common error.
The pre-applied thermal paste is rated not to separate, run, migrate or bleed, so no re-paste is scheduled; only the system fans and heatsinks require periodic dust cleaning to maintain the 85 W TDP cooling margin.
The 85 W TDP per processor is the first constraint; prolonged turbo pushes the cooling solution to its thermal ceiling before memory bandwidth or the 768 GB DDR4-2400 capacity becomes a bottleneck.
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