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Lirealar 85x45mm thermal pad 12.8 W/mK 15g

SKU CH-94TJ-8N0WX MPN 85x45mm

A 15 g silicone thermal pad measuring 85×45 mm with 12.8 W/mK conductivity, non-conductive insulation, and a -40 °C to 200 °C operating range for GPU, CPU, or laptop heatsinks

  • Volume / Net Weight15g
  • Thermal Conductivity12.8 W/mK,
  • Long Term Operating Temperature-40 C to +400C
  • SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/c
  • FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi

Type Thermal Pad

Model 85x45mm

De overstregede versioner findes, men er ikke på lager her.

Specification 0.5mm

Vis 1 flere konfigurationer
  • Efficient heat transfer with 12.8 W/mK conductivity
  • Safe non-conductive insulation exceeding 9.8 kV breakdown voltage
  • Flexible gap-filling pad compresses to 0.5 mm thickness
  • Wide operating range from -40 °C to 200 °C
  • Reusable non-curing silicone stays effective over time

12.8 W/mK thermal pad for precise gap filling

This 85 x 45 mm silicone pad delivers 12.8 W/mK conductivity to bridge uneven surfaces between chips and heatsinks. The gray, non-curing material stays pliable across a -40 °C to 200 °C operating range. At 0.5 mm thick it conforms without excess pressure on delicate components.

Suits tight spaces needing electrical insulation

Builders fitting laptop GPUs, compact desktop cards or LED drivers will appreciate the single-pad format and natural tack. The 3.1 g/cc density and 30–55 Shore C hardness resist pump-out while remaining non-conductive at over 9.8 kV breakdown. Not suited for large-area CPU lids or builds requiring reusable phase-change sheets.

0.5 mm thickness defines the contact stack

This exact height determines whether the pad will seat correctly without lifting the cooler or leaving air gaps. Measure your specific stack-up before ordering; a thicker or thinner gap demands a different pad.

Fordele

  • Efficient heat transfer with 12.8 W/mK conductivity
  • Safe non-conductive insulation exceeding 9.8 kV breakdown voltage
  • Flexible gap-filling pad compresses to 0.5 mm thickness
  • Wide operating range from -40 °C to 200 °C
  • Reusable non-curing silicone stays effective over time

Specifikationer

SeriesThermal Pad
Model85x45x3mm
Volume / Net Weight15g
Thermal Conductivity12.8 W/mK,
Long Term Operating Temperature-40 C to +400C
SpecificationsColor:Gray Thermal Conductivity:12.8W/M-K Density:3.1±0.2g/cc Hardness:30-55(Sc) Breakdown Voltage:>9.8KV(1mm) Temperature Range:-40°C~200°C
FeaturesNon-Elecnical Conducive Non-Corrosive, Non-Curing & Non-Toxi One Pad , multi-purpose, durable,insulated, non-conductive lnsulation does not conduct electricity and is safe for use Natural viscosity, easy to assemble and reusable

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Spørgsmål om denne vare

What size heatsink surface is this 85 x 45 mm pad designed to cover?

The pad measures 85 mm by 45 mm with a 0.5 mm thickness, so it matches a heatsink footprint of those exact dimensions.

Can I stack this 12.8 W/mK pad on top of an older thermal pad that is still in place?

Stacking pads adds thermal resistance; remove the old material completely so the single 12.8 W/mK layer contacts both surfaces directly.

How do I confirm the pad is seated correctly after installation?

With the cooler mounted, the grey silicone should be evenly compressed to roughly 0.5 mm with no visible gaps or air bubbles around the edges.

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