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Small white syringe with grey cap containing 1.0g grey thermal paste

Thermal Grizzly

Thermal Grizzly Aeronaut 1.0g thermal paste

SKU CH-406N-Z5S5Y

High-performance thermal compound with 8.5 W/mK conductivity for CPUs, GPUs and consoles in a 1.0 g syringe

  • Volume / Net Weight1.0g
  • Thermal Conductivity8.5 W/Mk
  • Long Term Operating Temperature150 °C / +200°C
  • FeaturesThermal Resistance: 0,0129 K/W Electrical Conductivity: 0 pS

Weight 1g

  • High thermal conductivity of 8.5 W/mK for efficient heat transfer
  • Zero electrical conductivity at 0 pS/m prevents short-circuit risk
  • Syringe applicator enables precise placement on CPU, GPU and console chips
  • Long-term stability up to 150 °C operating temperature with no curing
  • Low thermal resistance of 0.0129 K/W reduces component temperatures effectively

1 g high-performance thermal paste

Thermal Grizzly Aeronaut is a 1.0 g syringe of non-electrically-conductive thermal compound rated at 8.5 W/mK thermal conductivity and 0.0129 K/W thermal resistance. It targets DIY builders and technicians who want a reliable, easy-to-apply paste for CPUs, GPUs and console coolers without the risk of short circuits. The syringe design places material precisely on the die or heat spreader.

Replaces stock or dried-out paste

Swapping factory-applied or aged compound for Aeronaut can lower junction temperatures immediately after the first mount. The jump is worth it when the original paste has pumped out, cracked or was applied too thickly, or when a builder wants a non-curing formula that survives repeated thermal cycles from -150 °C to +200 °C. It is not for users who need the absolute highest conductivity metal-based pastes provide.

Syringe volume limits coverage area

The 1.0 g / 1.5 ml fill suits a single CPU or GPU application with a small safety margin; larger dies, direct-die laptop chips or multiple consoles may require a second syringe. Viscosity of 110–160 Pa·s resists pump-out but demands steady pressure for thin, even spreading. The paste contains no electrically conductive particles, so accidental overflow onto PCB traces is harmless.

Fordele

  • High thermal conductivity of 8.5 W/mK for efficient heat transfer
  • Zero electrical conductivity at 0 pS/m prevents short-circuit risk
  • Syringe applicator enables precise placement on CPU, GPU and console chips
  • Long-term stability up to 150 °C operating temperature with no curing
  • Low thermal resistance of 0.0129 K/W reduces component temperatures effectively

Specifikationer

BrandThermal Grizzly
SeriesAeronaut
Volume / Net Weight1.0g
Thermal Conductivity8.5 W/Mk
Long Term Operating Temperature150 °C / +200°C
FeaturesThermal Resistance: 0,0129 K/W
Electrical Conductivity: 0 pS/m
Viscosity: 110–160 Pas
SpecificWeight: 2,6g/cm3
Temperature: -150 °C / +200°C
Capacity: 1g | 1,5ml/3,9g | 3ml/7,8g | 10ml/26g

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Spørgsmål om denne vare

Does the 1.0 g syringe provide enough paste for both a CPU and a GPU application?

The 1.0 g volume is typically sufficient for several CPU or GPU mounts, as each application only requires a small pea-sized amount.

How do I apply the paste correctly with the syringe, and what common mistake should I avoid?

Dispense a small dot onto the centre of the die, then mount the cooler straight down; avoid spreading it manually, which can trap air bubbles.

Will the compound dry out or need replacement after long-term use at high temperatures?

The paste is rated for continuous operation up to 150 °C with no curing, so it maintains performance without scheduled replacement.

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