Team Group TLZGD416G3200HC16FDC01 16GB (2 x 8GB) DDR4 3200 desktop RAM
- 16GB (2 x 8GB)
- DDR4 3200 (PC4 2560…
Me võtame vastu krüptoraha — nii saab teie hoitav krüptoraha osta päris riistvara.Makske krüptorahaga, kulutage seda päris riistvarale. Tasuta kindlustatud tarne kogu maailmas, üle 399 $. Lihtsad, kaubamärgita väliskarbid, saadetud Saksamaalt.Tasuta kindlustatud tarne üle 399 $. Teie kurss lukustatakse 30 minutiks kohe, kui kassa avaneb.Kurss lukustatud 30 minutiks. Iga toode on pitseeritud, selle seerianumber on kontrollitud ja sellel kehtib 24-kuuline garantii.Pitseeritud, 24-kuulise garantiiga.
Team Group
32 GB dual-channel DDR4 kit running at 3200 MT/s with CL16 timings and a 1.35 V aluminum heat spreader
Capacity 32GB (2 x 16GB)
Speed DDR4 3200 (PC4 25600)
Option 16-20-20-40
Team Group T-FORCE VULCAN Z supplies 32GB of desktop memory in a matched pair of 16GB modules. The kit runs at DDR4 3200 with CL16 latency and 1.35V voltage. An aluminium heat spreader uses high-conductivity adhesive to move heat away from the ICs. Intel XMP 2.0 is supported for automatic configuration.
The 3200 CL16 rating suits mainstream Intel and AMD platforms that officially support this speed. Systems limited to lower memory frequencies will downclock the modules. Workstations requiring ECC or registered DIMMs should choose a different product line.
The decisive figure is the DDR4 3200 CL16 1.35V rating; it determines whether the motherboard and CPU can run the kit at its advertised timing without manual tuning. Verify the platform’s qualified-vendor list before purchase.
| Brand | Team |
|---|---|
| Series | T-FORCE VULCAN Z |
| Model | TLZGD432G3200HC16FDC01 |
| Capacity | 32GB (2 x 16GB) |
| Type | 288-Pin PC RAM |
| Speed | DDR4 3200 (PC4 25600) |
| CAS Latency | CL16 |
| Timing | 16-20-20-40 |
| Voltage | 1.35V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| BIOS/Performance Profile | Intel XMP 2.0 |
| Color | Gray |
| Heat Spreader | Aluminum |
| Features | Simple design to perfectly protect the cooling module High thermal conductive adhesive Supports Intel & AMD motherboards Selected high-quality IC Supports XMP2.0 Energy saving with ultra-low working voltage |
| Tarnekaal | 0.14 kg |
| Pakendi mõõtmed | 152 × 102 × 10 mm |
Selle mudeli teised versioonid
Sama seeria, erinev mälumaht, jahutus või taktsagedus — võrrelge enne otsustamist.
The modules default to standard DDR4 JEDEC speeds; enabling the XMP 2.0 profile in the BIOS is required to reach the rated 3200 MT/s with timings of 16-20-20-40 at 1.35 V.
The XMP 2.0 profile raises the voltage to 1.35 V, which is within the DDR4 specification; most modern Intel and AMD platforms accept this voltage when the XMP profile is activated.
The heat spreader is built from a single 0.8 mm thick aluminum piece; check your CPU cooler specifications for memory-slot clearance to ensure the modules fit without interference.
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