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Seuratut tuotteet Kirjaudu sisään
E-ATX motherboard with massive heatsinks, U-shaped heatpipe, 3D VC M.2 heatsink, LGA 1851 socket, CPU installed, black finish

ASUS

ASUS ROG MAXIMUS Z890 EXTREME Intel motherboard & Core Ultra 9 285K CPU Combo

SKU CH-XKWQ-Y4Y2R

A combo pairing a Z890 E-ATX board with LGA 1851 socket, 24+2+1+2 power stages, DDR5 up to 9200 MT/s, WiFi7, 2.5G and 10G LAN, PCIe 5.0 M.2, Thunderbolt 5.

  • CPU Socket TypeLGA 1851
  • CPU TypeIntel Core Ultra Processors (Series 2)
  • ChipsetIntel Z890
  • Number of Memory Slots4x288pin (DDR5)
  • Maximum Memory Supported256GB
  • Channel SupportedDual Channel

Motherboard ROG MAXIMUS Z890 EXTREME

+CPU +Ultra9 285K

  • AI overclocking and cooling simplify tuning for higher speeds
  • CES 2025 Innovation Award honours exceptional design and engineering
  • LGA 1851 socket supports Intel Core Ultra 9 285K CPU
  • 24+2+1+2 power stages with massive heatsinks and U-shaped heatpipe
  • WiFi7, 10G LAN and Thunderbolt 5 deliver ultra-fast connectivity

Intel LGA 1851 combo for AI workloads

The bundle pairs a ROG MAXIMUS Z890 EXTREME motherboard with an Intel Core Ultra 9 285K processor on the LGA 1851 platform. It targets builders who want a single SKU for advanced AI PC tasks and high-end desktop performance. The board delivers a 24+2+1+2 stage power design and supports DDR5 memory up to 9200 MT/s. Buyers who need a second CPU or a different socket should look elsewhere.

Massive heatsinks with U-shaped heatpipe and 3D VC

Large heatsinks integrate with the I/O cover and connect to the power stages through high-conductivity thermal pads. A U-shaped heatpipe links the VRM and chipset zones, while a 3D vapor-chamber heatsink covers the primary PCIe 5.0 M.2 slot. AI Cooling II adjusts fan curves automatically based on system load. The included processor has a 125 W base power rating and no cooler in the box.

AI Advisor, AI Overclocking.

ASUS AI Advisor provides natural-language guidance for BIOS settings. AI Overclocking profiles the CPU and cooling to suggest stable frequency targets. AI Networking II optimises traffic across the 10 Gbps and 2.5 Gbps Ethernet ports plus WiFi7. NitroPath DRAM Technology, DIMM Fit, DIMM Flex and AEMP III simplify DDR5 tuning. Thunderbolt 5 adds two 80 Gbps USB-C ports for high-speed peripherals.

Kohokohdat

  • AI overclocking and cooling simplify tuning for higher speeds
  • CES 2025 Innovation Award honours exceptional design and engineering
  • LGA 1851 socket supports Intel Core Ultra 9 285K CPU
  • 24+2+1+2 power stages with massive heatsinks and U-shaped heatpipe
  • WiFi7, 10G LAN and Thunderbolt 5 deliver ultra-fast connectivity

Tekniset tiedot

BrandASUS
SeriesROG MAXIMUS Z890 EXTREME+Ultra9 285K
ModelROG MAXIMUS Z890 EXTREME+Ultra9 285K
CPU Socket TypeLGA 1851
CPU TypeIntel Core Ultra Processors (Series 2)
ChipsetIntel Z890
Number of Memory Slots4x288pin (DDR5)
Maximum Memory Supported256GB
Channel SupportedDual Channel
Memory FeatureSupport up to 9200+MT/s (OC), Non-ECC, Un-buffered ,Clocked Unbuffered DIMM (CUDIMM)*
Dual Channel Memory Architecture
Supports Intel Extreme Memory Profile (XMP) memory module
ASUS Enhanced Memory Profile III (AEMP III)
Supports DIMM Flex
DIMM Fit
NitroPath DRAM Technology
* Non-ECC, un-buffered DDR5 memory supports On-Die ECC function.
PCI Express 5.0 x16Intel Core Ultra Processors (series 2)*
2 x PCIe 5.0 x16 slots (supports x16 or x8/x8 or x8/x4/x4 modes)**
PCI Express x4Intel Z890 Chipset**
1 x PCIe 4.0x4 slot
**M.2_3 & M.2_4 share bandwidth with PCIEX16(G5)_2. When M.2_3 is enabled, PCIEX16(G5)_1 will run x8 & PCIEX16(G5)_2 will run x4. When M.2_3 & M.2_4 are enabled, PCIEX16(G5)_1 will run x8 & PCIEX16(G5)_2 will disabled.
Serial ATA (SATA)4 x SATA 6Gb/s
M.2Support Intel Core Ultra Processors (series 2)*
M.2_1 slot (Key M), type 2242/2260/2280/22110 (supports PCIe 5.0 x4 mode)
M.2_2 slot (Key M), type 2242/2260/2280 (supports PCIe 4.0 x4 mode)
M.2_3 slot (Key M), type 2242/2260/2280/22110 (supports PCIe 5.0 x4 modes)**
M.2_4 slot (Key M), type 2242/2260/2280 (supports PCIe 5.0 x4 modes)**
Intel Z890 Chipset
DIMM.2_1 slot (Key M) via ROG Q-DIMM.2, type 2230/2242/2260/2280/22110 (supports PCIe 4.0 x4 mode)
DIMM.2_2 slot (Key M) via ROG Q-DIMM.2, type 2230/2242/2260/2280/22110 (supports PCIe 4.0 x4 mode)
**M.2_3 & M.2_4 share bandwidth wit
SATA RAID*Intel Rapid Storage Technology supports PCIe RAID 0/1/5/10, SATA RAID 0/1/5/10, M.2 slot from CPU only supports RAID 0/1/5.
Audio ChannelsROG SupremeFX 7.1 Surround Sound High Definition Audio CODEC ALC4082**
- Impedance sense for front and rear headphone outputs
- Supports: Jack-detection, Multi-streaming, Front Panel MIC Jack-retasking
- High quality 120 dB SNR stereo playback output and 10 dB SNR recording input
- Supports up to 32-Bit/384 kHz playback on front panel
Audio Features
- SupremeFX Shielding Technology
- ESS ES9219 QUAD DAC
- LED-illuminated audio jacks
- Rear optical S/PDIF out port
- Premium audio capacitors
* A chassis with an HD audio module in the front panel is required to support 7.1 Surround Soun
Max LAN Speed10Gbps + 2.5Gbps
Wireless LANWi-Fi 802.11 be
BluetoothBluetooth 5.4
Back I/O Ports2 x Thunderbolt 5 USB Type-C ports
1 x USB 20Gbps port (1 x USB Type-C)
7 x USB 10Gbps ports (5 x Type-A + 2 x USB Type-C)
1 x HDMITM port
1 x Wi-Fi Module
1 x Intel 2.5Gb Ethernet port
1 x Marvell AQtion 10Gb Ethernet port
2 x LED-illuminated audio jacks
1 x Optical S/PDIF out port
1 x BIOS FlashBack button
1 x Clear CMOS button
Onboard USB1 x USB 20Gbps connector (supports USB Type-C)
1 x USB 10Gbps connector (supports USB Type-C)
2 x USB 5Gbps headers support 4 additional USB 5Gbps ports
2 x USB 2.0 headers support 4 additional USB 2.0 ports
Other ConnectorsFan and Cooling related
1 x 4-pin CPU Fan header
1 x 4-pin CPU OPT Fan header
2 x 4-pin Chassis Fan headers
2 x 4-pin Radiator Fan headers
2 x W_PUMP+ headers
1 x WB_SENSOR header
Miscellaneous
1 x 6-pin ARGB Gen 2 header to support 2 x ARGB Gen 2 headers
2 x Addressable Gen 2 header
1 x Alteration PCIe mode switch
4 x BCLK button
1 x BIOS Switch button
1 x FlexKey button
1 x Front Panel Audio header (F_AUDIO)
1 x LN2 Mode jumper
18 x ProbeIt Measurement Points
1 x ReTry button
2 x RSVD switchs
1 x RSVD header
1 x Safe Boot button
1 x Slow Mode switch
1 x Start button
1 x 10-1 pin Sy
BIOS Feature2 x 256 Mb Flash ROM, UEFI AMI BIOS
SoftwareROG Exclusive Software
- ROG CPU-Z
- Dolby Atmos
- Internet Security (1-year full version)
ASUS Exclusive Software
Armoury Crate
- AIDA64 Extreme (1 year full version)
- Aura Creator
- Aura Sync
- Fan Xpert 4 (with AI Cooling II)
- GameFirst
- HWiNFO
- Power Saving
- LCD Display
ASUS AI Advisor
ASUS Driver Hub
Turbo Vcore
ASUS GlideX
Thunderbolt Share
USB Wattage Watcher
WinRAR (40 Days Free Trial)
Adobe Creative Cloud (Free Trial)
UEFI BIOS
AI Overclocking Guide
NPU Boost
ASUS EZ DIY
- ASUS CrashFree BIOS 3
- ASUS EZ Flash 3
- ASUS UEFI BIOS EZ Mode
- ASUS MyHotkey
Windows 11Windows 11, Windows 10 64-bit
Form FactorExtended ATX
Dimensions (W x L)12.0" x 10.9"
Power Pin1 x 24-pin Main Power connector
2 x 8-pin +12V CPU Power connector
1 x 8-pin PCIe Power connector
FeaturesExtreme OC Kit
- FlexKey button
- LN2 Mode
- ProbeIt
- ReTry button
- Safe boot button
- Start button
- Slow Mode
Extreme Engine Digi+
- 10K Black Metallic Capacitors
- MicroFine Alloy Choke
ASUS Q-Design
- M.2 Q-Latch
- M.2 Q-Release
- M.2 Q-Slide
- Q-Release Slim (with PCIe SafeSlot)
- Q-Antenna
- Q-Code
- Q-Connector
- Q-Dashboard
- Q-LED (CPU [red], DRAM [yellow], VGA [white], Boot Device [yellow green])
- Q-Slot
- Q-DIMM.2
ASUS Thermal Solution
- Fan bracket
- M.2 heatsink backplate
- M.2 heatsink
- Metal backplate
- VRM heatsink design
- 3D VC M.2 Heatsink
ASUS EZ DIY
- Backpla

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Kysymyksiä tästä tuotteesta

How do I install the LGA 1851 CPU into the socket without bending pins?

Align the triangle marker on the Core Ultra 9 285K with the socket corner, lower it straight down without pressure, then close the retention lever; the integrated loading mechanism seats the processor evenly across the 1851 contacts.

What maintenance will the 125 W processor and 24+2+1+2 stage VRM need after prolonged use?

Clean dust from the massive heatsinks, U-shaped heatpipe and 3D VC M.2 heatsink every 6-12 months; reapply thermal paste on the CPU die if temperatures rise above your normal baseline.

Which thermal or power limit appears first when the 285K runs all-core workloads continuously?

The 125 W base power envelope is the first ceiling; AI Cooling II and the VRM heatsink array manage the resulting heat, but sustained all-core boost will sit at or below that 125 W figure.

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