Hyväksymme kryptoa — hallussasi olevat kolikot voivat näin ostaa oikeaa laitteistoa.Maksa kryptolla, käytä se oikeaan laitteistoon. Ilmainen vakuutettu toimitus maailmanlaajuisesti yli 399 $. Neutraalit, tuotemerkittömät ulkopakkaukset, lähetetään Saksasta.Ilmainen vakuutettu toimitus yli 399 $. Kurssisi lukitaan 30 minuutiksi heti, kun kassa avautuu.Kurssi lukittu 30 minuutiksi. Jokainen tuote on sinetöity, sen sarjanumero on tarkistettu, ja sillä on 24 kuukauden takuu.Sinetöity, 24 kuukauden takuu.

Seuratut tuotteet Kirjaudu sisään
Rectangular grey thermal pad 40 by 80 by 1mm

Corn Electronics

Corn Electronics Thermal Paste 40x80x1mm

SKU CH-R223-4211N

Silicone-based thermal gap filler pad measuring 40x80x1mm with low outgassing and RoHS compliance

Option 40*80*1mm

  • Low contact resistance thanks to excellent surface wetting
  • Reduced board and component stress from low pressure deflection
  • Clean operation with low outgassing and D3-D20 under 20ppm
  • Suits large tolerance applications across CPU, VGA, memory and SSD
  • RoHS and REACH compliant environmentally friendly silicone formula

Thermal gap filler for CPU VGA memory SSD

Corn Electronics thermal compound fills gaps between heat-generating components and coolers with a 40 by 80 by 1 millimetre silicone pad. The material suits processors graphics cards memory modules and solid state drives where uneven surfaces need reliable contact. Builders who need a liquid paste for thin bond lines will not find it here.

Low pressure deflection and low outgassing

The pad compresses with minimal force so it reduces stress on circuit boards and mounted parts while maintaining good thermal transfer. Low outgassing and D3 D20 below twenty parts per million keep the assembly clean over time. The compound meets RoHS and REACH requirements for environmentally friendly use.

One millimetre thickness for large tolerance stacks

The 1mm pad handles wider gaps than typical grease allowing it to bridge uneven mounting surfaces without excessive pressure. Dimensions of 40 by 80 millimetres cover common chip footprints but may be too small for large cold plates or multi die modules. Installers simply cut or place the sheet without curing time or mess.

Kohokohdat

  • Low contact resistance thanks to excellent surface wetting
  • Reduced board and component stress from low pressure deflection
  • Clean operation with low outgassing and D3-D20 under 20ppm
  • Suits large tolerance applications across CPU, VGA, memory and SSD
  • RoHS and REACH compliant environmentally friendly silicone formula

Tekniset tiedot

Tälle tuotteelle ei ole vielä julkaistu teknisiä tietoja.

Tämän mallin muut versiot

1 lisää samasta mallistosta

Sama tuoteperhe, eri muisti, jäähdytin tai kellotaajuus — vertaile ennen päätöstä.

Kysymyksiä tästä tuotteesta

How do I install the 40x80x1mm thermal pad without damaging it?

Cut the pad to size if needed, remove both protective films, place it flat on the component, then apply light even pressure when mounting the heatsink; the material compresses with low force so over-tightening screws is the step that causes tears.

When will the Laird Tflex HD90000 pad need replacement?

The silicone compound is rated for low outgassing and low D3-D20 volatility under 20ppm, so it retains its thermal properties for years; plan to replace it only when you disassemble the cooler or if the pad shows physical damage or drying.

What thermal limit appears first during sustained loads?

The pad's thickness of 1mm sets the minimum bond-line; under continuous high power the component temperature will rise until the heatsink reaches equilibrium, so the interface resistance of this specific gap filler becomes the limiting factor before the cooler saturates.

Myös tällä osastolla

Asiakkaat vertailivat myös näitä

Sama osasto, sama kassa — kahdeksan kryptovaluuttaa ja 30 minuutin kurssilukko.