저희는 암호화폐로 결제를 받습니다 — 보유하신 코인으로 실제 하드웨어를 구매하실 수 있습니다.암호화폐로 결제하고, 실제 하드웨어 구매에 사용하십시오. 전 세계 어디서나 US$399 이상 구매 시 무료 보험 배송. 무지 상자에 담아 독일에서 발송합니다.US$399 이상 구매 시 무료 보험 배송. 체크아웃을 시작하면 30분 동안 환율이 잠깁니다.30분간 환율 잠금. 모든 제품은 밀봉된 상태로 일련번호를 확인한 후 24개월 보증을 제공합니다.밀봉 포장, 24개월 보증.

가격 추적 로그인
Rectangular grey thermal pad 40 by 80 by 1mm

Corn Electronics

Corn Electronics Thermal Paste 40x80x1mm

SKU CH-R223-4211N

Silicone-based thermal gap filler pad measuring 40x80x1mm with low outgassing and RoHS compliance

Option 40*80*1mm

  • Low contact resistance thanks to excellent surface wetting
  • Reduced board and component stress from low pressure deflection
  • Clean operation with low outgassing and D3-D20 under 20ppm
  • Suits large tolerance applications across CPU, VGA, memory and SSD
  • RoHS and REACH compliant environmentally friendly silicone formula

Thermal gap filler for CPU VGA memory SSD

Corn Electronics thermal compound fills gaps between heat-generating components and coolers with a 40 by 80 by 1 millimetre silicone pad. The material suits processors graphics cards memory modules and solid state drives where uneven surfaces need reliable contact. Builders who need a liquid paste for thin bond lines will not find it here.

Low pressure deflection and low outgassing

The pad compresses with minimal force so it reduces stress on circuit boards and mounted parts while maintaining good thermal transfer. Low outgassing and D3 D20 below twenty parts per million keep the assembly clean over time. The compound meets RoHS and REACH requirements for environmentally friendly use.

One millimetre thickness for large tolerance stacks

The 1mm pad handles wider gaps than typical grease allowing it to bridge uneven mounting surfaces without excessive pressure. Dimensions of 40 by 80 millimetres cover common chip footprints but may be too small for large cold plates or multi die modules. Installers simply cut or place the sheet without curing time or mess.

주요 특징

  • Low contact resistance thanks to excellent surface wetting
  • Reduced board and component stress from low pressure deflection
  • Clean operation with low outgassing and D3-D20 under 20ppm
  • Suits large tolerance applications across CPU, VGA, memory and SSD
  • RoHS and REACH compliant environmentally friendly silicone formula

사양

이 상품에 대해 아직 공개된 사양이 없습니다.

이 모델의 다른 버전

같은 라인업에서 1개 더

같은 제품군에서 메모리·쿨러·클럭이 다릅니다 — 결정 전에 비교해 보세요.

이 상품에 대한 질문

How do I install the 40x80x1mm thermal pad without damaging it?

Cut the pad to size if needed, remove both protective films, place it flat on the component, then apply light even pressure when mounting the heatsink; the material compresses with low force so over-tightening screws is the step that causes tears.

When will the Laird Tflex HD90000 pad need replacement?

The silicone compound is rated for low outgassing and low D3-D20 volatility under 20ppm, so it retains its thermal properties for years; plan to replace it only when you disassemble the cooler or if the pad shows physical damage or drying.

What thermal limit appears first during sustained loads?

The pad's thickness of 1mm sets the minimum bond-line; under continuous high power the component temperature will rise until the heatsink reaches equilibrium, so the interface resistance of this specific gap filler becomes the limiting factor before the cooler saturates.

이 진열대의 다른 상품

고객들이 함께 비교한 상품

같은 진열대, 같은 체크아웃 — 코인 8종, 환율 잠금 30분.