Hyväksymme kryptoa — hallussasi olevat kolikot voivat näin ostaa oikeaa laitteistoa.Maksa kryptolla, käytä se oikeaan laitteistoon. Ilmainen vakuutettu toimitus maailmanlaajuisesti yli 399 $. Neutraalit, tuotemerkittömät ulkopakkaukset, lähetetään Saksasta.Ilmainen vakuutettu toimitus yli 399 $. Kurssisi lukitaan 30 minuutiksi heti, kun kassa avautuu.Kurssi lukittu 30 minuutiksi. Jokainen tuote on sinetöity, sen sarjanumero on tarkistettu, ja sillä on 24 kuukauden takuu.Sinetöity, 24 kuukauden takuu.

Seuratut tuotteet Kirjaudu sisään
Dynatron T319 copper heatsink with vapor chamber, stacked fins, 5.25 by 3.5 by 1.50 inches

Dynatron

Dynatron T319 CPU cooler copper vapor chamber 5.25x3.5x1.50in

SKU CH-2C4S-XKRVF MPN T319

Copper vapor-chamber heatsink measuring 5.25 by 3.5 by 1.50 inches for efficient CPU cooling

  • TypeHeatsinks only
  • Heatsink MaterialCopper Stacked Fins with Vapor Chamber
  • Heatsink Dimensions5.25"x3.5"x1.50"
  • Copper vapor chamber spreads heat quickly across the base
  • Stacked copper fins increase surface area for efficient dissipation
  • Compact 5.25 x 3.5 x 1.50 inch footprint fits tight builds
  • Heatsink-only design allows custom fan selection for your airflow needs
  • All-copper construction provides high thermal conductivity without added weight

Copper Vapor Chamber Heatsink

The Dynatron T319 is a passive copper heatsink that uses a vapor chamber and stacked fins to spread heat from the processor. It suits builders who want silent operation or who plan to add their own airflow solution. Buyers needing an integrated fan or a liquid-cooling block will not find those features here.

Heatsink Dimensions and Mounting

At 5.25 by 3.5 by 1.50 inches the cooler occupies a compact footprint that leaves room for tall memory modules and nearby voltage-regulator heatsinks. The vapor-chamber base distributes heat across the fin stack so case fans can pull it away without a dedicated cooler fan. Ensure your chassis provides enough airflow to move heat from the fins.

Sustained Thermal Behaviour

The copper construction and vapor chamber give the T319 high thermal capacity, letting it absorb prolonged loads without rapid temperature spikes. Heat spreads evenly through the fin array so steady airflow keeps temperatures stable during long render or compile sessions. Without active cooling the heatsink will eventually saturate under continuous heavy work.

Kohokohdat

  • Copper vapor chamber spreads heat quickly across the base
  • Stacked copper fins increase surface area for efficient dissipation
  • Compact 5.25 x 3.5 x 1.50 inch footprint fits tight builds
  • Heatsink-only design allows custom fan selection for your airflow needs
  • All-copper construction provides high thermal conductivity without added weight

Tekniset tiedot

BrandDynatron
ModelT319
TypeHeatsinks only
Heatsink MaterialCopper Stacked Fins with Vapor Chamber
Heatsink Dimensions5.25"x3.5"x1.50"
Lähetyspaino0.31 kg
Pakkauksen mitat140 × 91 × 41 mm

Kysymyksiä tästä tuotteesta

What is the height of the copper stacked-fin heatsink with vapor chamber?

The heatsink measures 1.50 inches tall, 5.25 inches long and 3.5 inches wide.

Does the T319 include a fan for active airflow during continuous operation?

The unit is supplied as heatsink only; a separate fan must be mounted for active cooling.

Which socket mounting hardware must the buyer already have to install this cooler?

The package contains only the copper vapor-chamber heatsink; socket-specific brackets are not included.

Myös tällä osastolla

Asiakkaat vertailivat myös näitä

Sama osasto, sama kassa — kahdeksan kryptovaluuttaa ja 30 minuutin kurssilukko.