Akceptujemy kryptowaluty — posiadane środki można więc wykorzystać na zakup prawdziwego sprzętu.Płatność kryptowalutą — realny sprzęt w zamian. Bezpłatna, ubezpieczona dostawa na całym świecie powyżej 399 $. Neutralne kartony, bez oznaczeń, wysyłane z Niemiec.Bezpłatna, ubezpieczona dostawa powyżej 399 $. Kurs zostaje zablokowany na 30 minut od otwarcia kasy.Kurs zablokowany na 30 minut. Każdy produkt jest fabrycznie zapieczętowany, jego numer seryjny jest sprawdzany, a całość objęta jest 24-miesięczną gwarancją.Zapieczętowane fabrycznie, 24 miesiące gwarancji.

Obserwowane produkty Zaloguj się
Dynatron T319 copper heatsink with vapor chamber, stacked fins, 5.25 by 3.5 by 1.50 inches

Dynatron

Dynatron T319 CPU cooler copper vapor chamber 5.25x3.5x1.50in

SKU CH-2C4S-XKRVF MPN T319

Copper vapor-chamber heatsink measuring 5.25 by 3.5 by 1.50 inches for efficient CPU cooling

  • TypeHeatsinks only
  • Heatsink MaterialCopper Stacked Fins with Vapor Chamber
  • Heatsink Dimensions5.25"x3.5"x1.50"
  • Copper vapor chamber spreads heat quickly across the base
  • Stacked copper fins increase surface area for efficient dissipation
  • Compact 5.25 x 3.5 x 1.50 inch footprint fits tight builds
  • Heatsink-only design allows custom fan selection for your airflow needs
  • All-copper construction provides high thermal conductivity without added weight

Copper Vapor Chamber Heatsink

The Dynatron T319 is a passive copper heatsink that uses a vapor chamber and stacked fins to spread heat from the processor. It suits builders who want silent operation or who plan to add their own airflow solution. Buyers needing an integrated fan or a liquid-cooling block will not find those features here.

Heatsink Dimensions and Mounting

At 5.25 by 3.5 by 1.50 inches the cooler occupies a compact footprint that leaves room for tall memory modules and nearby voltage-regulator heatsinks. The vapor-chamber base distributes heat across the fin stack so case fans can pull it away without a dedicated cooler fan. Ensure your chassis provides enough airflow to move heat from the fins.

Sustained Thermal Behaviour

The copper construction and vapor chamber give the T319 high thermal capacity, letting it absorb prolonged loads without rapid temperature spikes. Heat spreads evenly through the fin array so steady airflow keeps temperatures stable during long render or compile sessions. Without active cooling the heatsink will eventually saturate under continuous heavy work.

Najważniejsze cechy

  • Copper vapor chamber spreads heat quickly across the base
  • Stacked copper fins increase surface area for efficient dissipation
  • Compact 5.25 x 3.5 x 1.50 inch footprint fits tight builds
  • Heatsink-only design allows custom fan selection for your airflow needs
  • All-copper construction provides high thermal conductivity without added weight

Specyfikacja

BrandDynatron
ModelT319
TypeHeatsinks only
Heatsink MaterialCopper Stacked Fins with Vapor Chamber
Heatsink Dimensions5.25"x3.5"x1.50"
Waga przesyłki0.31 kg
Wymiary opakowania140 × 91 × 41 mm

Pytania dotyczące tego produktu

What is the height of the copper stacked-fin heatsink with vapor chamber?

The heatsink measures 1.50 inches tall, 5.25 inches long and 3.5 inches wide.

Does the T319 include a fan for active airflow during continuous operation?

The unit is supplied as heatsink only; a separate fan must be mounted for active cooling.

Which socket mounting hardware must the buyer already have to install this cooler?

The package contains only the copper vapor-chamber heatsink; socket-specific brackets are not included.

Także w tym dziale

Klienci porównywali też te produkty

Ten sam dział, ta sama kasa — osiem kryptowalut i 30-minutowa blokada kursu.