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BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
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SK hynix
SK hynix HMA82GS6CJR8N-VK 16GB 2Rx8 DDR4 2666 CL19 laptop RAM
16 GB DDR4 2666 CL19 SO-DIMM with 2Rx8 organisation for laptop memory upgrades
- Capacity16GB
- Type260-Pin DDR4 SO-DIMM
- SpeedDDR4 2666 (PC4 21300)
- CAS LatencyCL19
- Voltage1.20V
- ECCNo
- 16 GB capacity for demanding multitasking
- DDR4 2666 speed for responsive performance
- CL19 latency for stable operation
- 20 V low voltage for efficient power use
- 260-pin SO-DIMM fits standard laptop slots
16 GB DDR4 SO-DIMM for notebooks
This 16 GB DDR4 SO-DIMM uses a 260-pin layout and runs at 2666 MT/s with CL19 latency. It operates at 1.20 V and is unbuffered, making it suitable for standard laptop memory slots. The module is organised as 2Rx8 and carries SK hynix branding.
Dual-rank layout and PC4-21300 rating
The 2Rx8 organisation provides two ranks per module, which can improve memory-controller efficiency on platforms that benefit from rank interleaving. The PC4-21300 designation confirms the 2666 MT/s data rate, so the module delivers that throughput without manual configuration.
16 GB capacity ceiling
A single 16 GB module fills one SO-DIMM slot and suits workloads such as multitasking, virtual machines and large datasets that exceed 8 GB. Systems limited to one slot or a 16 GB maximum cannot expand further, and boards requiring ECC will not use this non-ECC module.
נקודות עיקריות
- 16 GB capacity for demanding multitasking
- DDR4 2666 speed for responsive performance
- CL19 latency for stable operation
- 20 V low voltage for efficient power use
- 260-pin SO-DIMM fits standard laptop slots
מפרט טכני
| Capacity | 16GB |
|---|---|
| Type | 260-Pin DDR4 SO-DIMM |
| Speed | DDR4 2666 (PC4 21300) |
| CAS Latency | CL19 |
| Voltage | 1.20V |
| ECC | No |
| Buffered/Registered | Unbuffered |
שאלות על הפריט הזה
Will the 2Rx8 rank configuration require any future maintenance or replacement?
The 2Rx8 dual-rank layout is a fixed hardware characteristic; no maintenance or replacement is needed for the rank structure itself.
What limit appears first when the module runs continuously at DDR4 2666 CL19?
Sustained operation stays within the 1.20 V specification, so the first limit encountered is the rated speed and latency envelope of DDR4 2666 CL19.
How much heat and power does the 16 GB stick produce during all-day use?
At 1.20 V the module draws only the power required for DDR4 2666 operation, generating minimal heat that a standard laptop cooling system handles without extra measures.
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