BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
Kami menerima kripto — jadi koin yang anda simpan boleh membeli perkakasan sebenar.Bayar dengan kripto, belanjakannya untuk perkakasan sebenar. Penghantaran berinsurans percuma ke seluruh dunia untuk belian melebihi USD 399. Kotak biasa tanpa jenama, dihantar dari Jerman.Penghantaran berinsurans percuma untuk belian melebihi USD 399. Kadar anda dikunci selama 30 minit sebaik sahaja proses pesanan bermula.Kadar dikunci selama 30 minit. Setiap item disegel, nombor sirinya disemak, dan dilindungi waranti 24 bulan.Disegel, waranti 24 bulan.
Corsair
16 GB dual-channel DDR4-3200 kit with CL16 timings, 1.35 V XMP 2.0 profile and low-profile red anodized aluminium heat spreaders for broad Intel 300/400/500
This 16 GB kit contains two 8 GB DDR4 modules rated at 3200 MT/s with CL16 timings. It targets DIY professionals and power users who want stable overclocking headroom from a low-profile design.
The anodized aluminum spreader sits below many oversized CPU coolers, easing installation in tight builds. Intel XMP 2.0 support allows the motherboard to apply the rated speed and 1.35 V voltage automatically without manual tuning.
The red heatspreader adds a distinct visual accent for colour-coordinated rigs. Modules are validated across a wide range of DDR4 platforms, reducing the risk of POST issues when paired with current Intel 300, 400, 500 Series and AMD 300, 400, 500 Series chipsets.
| Brand | CORSAIR |
|---|---|
| Series | Vengeance LPX |
| Model | CMK16GX4M2E3200C16R |
| Capacity | 16GB (2 x 8GB) |
| Type | 288-Pin PC RAM |
| Speed | DDR4 3200 (PC4 25600) |
| CAS Latency | CL16 |
| Timing | 16-20-20-38 |
| Voltage | 1.35V |
| BIOS/Performance Profile | Intel XMP 2.0 |
| Color | Red |
| Heat Spreader | Anodized Aluminum |
| Features | Designed for high-performance overclocking Designed for great looks Performance and Compatibility Low-profile heatspreader design |
| Recommend Use | Intel 300 Series / AMD 300 Series / AMD 400 Series / AMD 500 Series / Intel 400 Series / Intel 500 Series |
| Berat penghantaran | 0.10 kg |
| Dimensi bungkusan | 155 × 90 × 10 mm |
The modules run at 1.35 V and include an anodized-aluminum heat spreader that moves heat away from the ICs, keeping temperatures controlled during extended use.
There are no moving parts; the low-profile aluminum spreader dissipates heat silently, so the kit adds no audible noise and minimal thermal load to the case.
Compatibility testing covers Intel 300, 400 and 500 Series and AMD 300, 400 and 500 Series chipsets, so one of those board families is required for automatic XMP 2.0 operation.
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