SPARTAN 1-to-9 SATA HDD/SSD Duplicator H09HSHEB
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Vi tar imot kryptovaluta — slik kan kryptovalutaene du eier, kjøpe ekte maskinvare.Betal med krypto, bruk den på ekte maskinvare. Gratis, forsikret levering verden over for bestillinger over 399 $. Nøytrale kartonger uten merking, sendt fra Tyskland.Gratis, forsikret levering over 399 $. Kursen din er låst i 30 minutter når kassen åpnes.Kurs låst i 30 minutter. Alle varer er forseglet, serienummerkontrollert og dekket av 24 måneders garanti.Forseglet, 24 måneders garanti.
Toshiba
512 GB M.2 2280 PCI Express 3.1 x4 SSD with 96-layer 3D TLC flash and SLC cache reaching 3180 MB/s read and 2960 MB/s write
The Toshiba XG6 KXG60ZNV512G is a 512 GB solid-state drive built on 96-layer 3D TLC BiCS FLASH with an SLC cache. It uses a single-sided M.2 2280 form factor and connects through a PCI Express 3.1 x4 interface. Sequential speeds reach up to 3180 MB/s read and 2960 MB/s write, with random performance up to 355000 read and 365000 write IOPS. Active power consumption stays at 4.7 W or less.
The drive targets power-sensitive laptops, performance-oriented desktops and data-centre roles such as server boot, caching and logging. Buyers who need capacities beyond 1024 GB or a self-encrypting model with TCG Opal 2.01 should evaluate other options. The single-sided layout fits space-constrained boards, but systems limited to PCIe 2.0 will not realise the rated throughput.
The PCI Express 3.1 x4 link is the single specification that determines whether this drive works at its rated speed. A motherboard or laptop must provide an M.2 slot wired for PCIe 3.1 x4; slots limited to PCIe 2.0 or x2 lanes will cap sequential and random performance. No other interface or protocol is supported by this model.
| Brand | TOSHIBA |
|---|---|
| NAND Flash Memory Type | SLC |
The XG6 series uses 96-layer BiCS FLASH 3D TLC with SLC cache, a design that spreads writes across the whole array so the flash typically outlasts the controller in normal workloads.
Sequential write tops out at 2960 MB/s, so the PCIe 3.1 x4 interface saturates before the NAND reaches its internal throughput ceiling.
Active power stays at 4.7 W or less and standby drops below 3 mW, so the single-sided M.2 2280 module generates minimal heat even under continuous load.
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