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Gray thermal paste syringe 2.5g Bitspower Baircool TP-1

Bitspower

Bitspower Baircool TP-1 Thermal Paste 2.5g

SKU CH-SWP4-TKTJE

Thermal compound with 6.5 W/m-K conductivity spreads easily, needs no burn-in, and is non-conductive

  • High thermal conductivity of 6.5 W/m-K for efficient heat transfer
  • Low thermal impedance of .009 K-in2/W reduces CPU temperatures
  • Non-silicone formula is non-corrosive and non-electrically conductive for safe application
  • Easy to spread evenly with no burn-in time required
  • Stable viscosity under 600000 CPS with no special storage conditions needed

Bitspower Baircool TP-1 Thermal Paste

This non-silicone thermal compound delivers a thermal conductivity of 6.5 W/m-K and a thermal impedance of 0.009 K-in2/W. It spreads easily and evenly without requiring special storage conditions. The gray grease is non-corrosive, non-electrically conductive, and requires no burn-in time. It offers excellent long-term stability with low dry-out characteristics.

Builders needing reliable CPU or GPU heat transfer

The 2.5 g syringe suits standard desktop processor applications and routine maintenance. Users requiring electrically conductive paste or larger volumes for multiple builds should look elsewhere. The compound is not intended for sub-ambient cooling scenarios or extreme overclocking setups demanding specialised liquid-metal interfaces. It also lacks specific certifications for industrial or server-grade validation.

2.5 g capacity covers several standard applications

A typical CPU installation uses a pea-sized drop, so the syringe provides enough material for multiple reseats or a small batch of builds. Viscosity below 600,000 CPS ensures consistent spreading without excessive force. The dielectric strength of 0.9 KV/mm confirms electrical isolation for safe use around exposed components. Specific gravity of 2.5 g/cm3 indicates a dense, stable paste that resists pump-out over time.

Puncte forte

  • High thermal conductivity of 6.5 W/m-K for efficient heat transfer
  • Low thermal impedance of .009 K-in2/W reduces CPU temperatures
  • Non-silicone formula is non-corrosive and non-electrically conductive for safe application
  • Easy to spread evenly with no burn-in time required
  • Stable viscosity under 600000 CPS with no special storage conditions needed

Specificații

BrandBitspower

Întrebări despre acest articol

What CPU cooler mounting hardware do I need before applying this 2.5 g syringe of Bitspower Baircool TP-1?

You need a compatible CPU cooler or water block already installed on the motherboard; the paste itself only fills the microscopic gaps between the cooler base and the processor heat spreader.

Can I use this 6.5 W/m-K non-silicone grease on an older processor that previously had standard silicone paste?

Yes — clean the old compound thoroughly with isopropyl alcohol, then apply the TP-1; its low 0.009 K-in²/W impedance and non-corrosive formula work safely on legacy CPUs.

How do I confirm the paste is performing correctly after assembly?

Monitor CPU core temperatures under load; a drop of several degrees versus the previous paste indicates the 6.5 W/m-K conductivity and low dry-out are working as intended.

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