GELID SOLUTIONS GP-Extreme 12W Thermal Pad 80x40x1.0mm

Precision gap filler for dense PCBs

The GP-Extreme thermal pad targets builders and repairers who need reliable heat transfer across uneven surfaces on graphics cards, laptops, consoles and other densely packed boards. Its soft composition conforms to height differences between memory ICs, MOSFETs and microcontrollers, ensuring consistent contact where rigid pads would leave air gaps. The material is non-electrically conductive, non-corrosive, non-curing and non-toxic, making it safe for direct application on exposed circuitry.

Limited by thickness and area per pad

Each sheet measures 80 by 40 millimetres with a 1.0 millimetre thickness, so a single piece covers only one contiguous zone; larger VRM arrays or multiple memory modules will require several pads cut from additional packs. The 12 W/mK conductivity rating applies only when the pad is compressed to its specified thickness, meaning over-tightening mounting hardware can reduce effective performance. No adhesive layer is present, so the pad relies solely on mounting pressure to stay in place during thermal cycling.

Choose the correct thickness for your stack height

The critical specification is the 1.0 millimetre thickness, which must match the exact gap between the component top and the heatsink base; a pad that is too thin will not bridge the gap, while one that is too thick prevents proper mounting pressure on adjacent parts. The product line also offers .5, 1.5, 2.0 and 3.0 millimetre options, but this pack contains only the 1.0 millimetre variant. Select the thickness that matches your measured stack height to achieve the rated thermal conductivity.