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Grey rectangular thermal pad 80 by 40 millimetres 1.0 millimetre thick

GELID SOLUTIONS

GELID SOLUTIONS GP-Extreme 12W Thermal Pad 80x40x1.0mm

SKU CH-8PVD-Y5D5B

High-conductivity 12 W/mK thermal pad sized 80×40×1.0 mm for memory, chipsets and dense PCB components

Option 80 x 40 x 1.0 mm

  • 12 W/mK thermal conductivity for superior heat transfer
  • Non-electrically conductive, non-corrosive and non-toxic material
  • Soft 1.0 mm pad conforms to uneven PCB surfaces
  • 80 × 40 mm dimensions suit large VGA cards and consoles
  • Easy installation on memory ICs, MOSFETs and SMD components

Precision gap filler for dense PCBs

The GP-Extreme thermal pad targets builders and repairers who need reliable heat transfer across uneven surfaces on graphics cards, laptops, consoles and other densely packed boards. Its soft composition conforms to height differences between memory ICs, MOSFETs and microcontrollers, ensuring consistent contact where rigid pads would leave air gaps. The material is non-electrically conductive, non-corrosive, non-curing and non-toxic, making it safe for direct application on exposed circuitry.

Limited by thickness and area per pad

Each sheet measures 80 by 40 millimetres with a 1.0 millimetre thickness, so a single piece covers only one contiguous zone; larger VRM arrays or multiple memory modules will require several pads cut from additional packs. The 12 W/mK conductivity rating applies only when the pad is compressed to its specified thickness, meaning over-tightening mounting hardware can reduce effective performance. No adhesive layer is present, so the pad relies solely on mounting pressure to stay in place during thermal cycling.

Choose the correct thickness for your stack height

The critical specification is the 1.0 millimetre thickness, which must match the exact gap between the component top and the heatsink base; a pad that is too thin will not bridge the gap, while one that is too thick prevents proper mounting pressure on adjacent parts. The product line also offers .5, 1.5, 2.0 and 3.0 millimetre options, but this pack contains only the 1.0 millimetre variant. Select the thickness that matches your measured stack height to achieve the rated thermal conductivity.

特長

  • 12 W/mK thermal conductivity for superior heat transfer
  • Non-electrically conductive, non-corrosive and non-toxic material
  • Soft 1.0 mm pad conforms to uneven PCB surfaces
  • 80 × 40 mm dimensions suit large VGA cards and consoles
  • Easy installation on memory ICs, MOSFETs and SMD components

仕様

BrandGELID Solutions

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この商品に関する質問

Should I choose the 0.5mm, 1.0mm, 1.5mm, 2.0mm or 3.0mm thickness for my GPU memory chips?

Match the pad thickness to the exact gap between the memory chips and the cooler base; the 1.0mm pad suits a 1.0mm gap, while larger gaps need 1.5mm, 2.0mm or 3.0mm and tighter gaps need 0.5mm.

What does the 12W/mK thermal conductivity figure mean once the pad is installed on a graphics card?

It indicates the pad transfers heat from memory ICs or MOSFETs to the heatsink more efficiently than lower-rated pads, lowering component temperatures under load.

The pad is 80x40mm — does that size limit which VRM layouts it can cover?

The 80x40mm sheet covers a large rectangular area; you can cut it to fit multiple smaller VRM zones or use it whole on a single large chipset block.

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