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AMD

AMD EPYC 7313 3.0 GHz 128MB L3 Cache Socket SP3 155W 100-000000329 server processor

SKU CH-QBAP-5ZBQ6

128 MB L3 cache server processor running at 3.0 GHz with a 155 W TDP for Socket SP3 platforms

  • CPU Socket TypeSocket SP3
  • 128 MB L3 cache accelerates data access for heavy workloads
  • 0 GHz base clock delivers steady performance across all cores
  • 7 nm Milan architecture improves efficiency per watt
  • 155 W TDP fits standard server thermal envelopes
  • Socket SP3 compatibility enables direct platform integration

Server processor for EPYC 7003 platforms

The AMD EPYC 7313 is a server-grade CPU built for the SP3 socket. It targets operators who need a 155 watt part with 128 megabytes of L3 cache in a 7 nanometre Milan design. The processor ships as an OEM unit without retail packaging.

Socket SP3 compatibility decides fit

This processor only works in motherboards equipped with a Socket SP3 interface. The 7003 series designation confirms the platform generation required. Buyers whose boards use a different socket cannot install this chip.

Sustained 155 watt thermal envelope

Under continuous load the processor maintains its 155 watt TDP rating rather than spiking higher for short bursts. The large L3 cache helps keep data close to the cores during extended compute tasks. Cooling solutions must be rated for the full 155 watt output.

Prednosti

  • 128 MB L3 cache accelerates data access for heavy workloads
  • 0 GHz base clock delivers steady performance across all cores
  • 7 nm Milan architecture improves efficiency per watt
  • 155 W TDP fits standard server thermal envelopes
  • Socket SP3 compatibility enables direct platform integration

Špecifikácie

SeriesAMD EPYC 7003
CPU Socket TypeSocket SP3

Otázky k tomuto produktu

What does the 3.0 GHz base clock mean for real-world server workloads?

The 3.0 GHz base clock is the guaranteed minimum frequency across all cores under sustained load, so multi-threaded tasks such as virtualisation or database queries run at this speed without throttling.

How does the SP3 socket limit platform choices?

The processor only fits motherboards with an SP3 socket and a chipset that supports the EPYC 7003 series, so you must match both the physical socket and the platform generation.

What cooler clearance and power delivery does the 155 W TDP require?

A 155 W thermal design power demands a server-grade heatsink or liquid cooler rated for at least that heat output and a motherboard VRM capable of delivering the corresponding current continuously.

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