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Silver Mini-ITX case with mixed steel and aluminum construction, vertical airflow design, 174x344x304mm

Corn Electronics

Corn Electronics V10 Mini-ITX PC Case Silver 174x344x304mm

SKU CH-55DZ-DDBFW MPN V10

Mini-ITX aluminium chassis with vertical airflow and a single USB 3.0 port

  • TypeMini-ITX
  • Vertical air channel improves thermal flow
  • Single USB 3.0 port provides fast front I/O
  • Mixed steel and aluminium build keeps weight at 3KG
  • Compact 174x344x304mm footprint fits tight spaces
  • Bottom-mounted PSU layout aids cable routing

Compact Mini-ITX Chassis

The Corn Electronics V10 is a Mini-ITX desktop chassis built from mixed steel and aluminium in silver. It targets builders who want a small-footprint system using an ITX motherboard. The vertical air channel layout supports water cooling installations. This unit ships without accessories.

Vertical Air Channel Constraints

The vertical air channel design dictates component placement and airflow path inside the 174mm by 344mm by 304mm enclosure. Builders must verify graphics card length and CPU cooler height against the internal clearance created by this layout. The single USB 3.0 front port limits high-speed peripheral connectivity. The bottom-mounted power supply location affects cable routing.

No Included Accessories

The package excludes all mounting hardware, drive cages and cable ties normally supplied with a chassis. Buyers who need a complete screw kit or additional drive brackets must source them separately. This omission suits experienced builders who already own spare parts. First-time assemblers should budget for the missing accessories.

Prednosti

  • Vertical air channel improves thermal flow
  • Single USB 3.0 port provides fast front I/O
  • Mixed steel and aluminium build keeps weight at 3KG
  • Compact 174x344x304mm footprint fits tight spaces
  • Bottom-mounted PSU layout aids cable routing

Špecifikácie

TypeMini-ITX

Otázky k tomuto produktu

What motherboard form factor does the V10 support?

The V10 is a Mini-ITX chassis that fits ITX motherboards only.

How does the vertical air channel affect thermals in a finished build?

The vertical air channel creates a direct upward path for heat, helping CPU and GPU exhaust rise out of the case without recirculating.

What does the single USB 3.0 front port limit in daily use?

One USB 3.0 port caps front-panel throughput to 5 Gbps and allows only one high-speed device at a time.

Aj v tomto oddelení

Zákazníci tiež porovnávali

Rovnaké oddelenie, rovnaká pokladňa — osem mien a kurz zablokovaný na 30 minút.