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BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
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NEMIX RAM
NEMIX RAM 256GB 16x16GB DDR5 5600 CL46 ECC RDIMM Supermicro H13DSG-O-CPU memory upgrade
256 GB kit of sixteen 16 GB DDR5-5600 registered ECC RDIMMs at CL46 and 1.1 V, validated for the Supermicro H13DSG-O-CPU motherboard
- Capacity256GB (16 x 16GB)
- Type288-Pin DDR5 RDIMM
- SpeedDDR5 5600 (PC5 44800)
- CAS LatencyCL46
- Voltage1.10V
- ECCYes
- 256 GB capacity from 16 matched 16 GB modules
- DDR5 5600 speed with CL46 latency runs at rated frequency
- Registered ECC architecture corrects single-bit errors for server stability
- 1 V low-voltage operation matches platform requirements exactly
- 288-pin RDIMM form factor fits Supermicro H13DSG-O-CPU motherboard
Exact-match DDR5 server upgrade
This 256 GB kit contains sixteen 16 GB DDR5 5600 Registered ECC RDIMMs built for the Supermicro H13DSG-O-CPU motherboard. It delivers the precise rank, voltage and timing the platform expects so every slot is recognised at full capacity and rated speed. The 1Rx8 organisation and 1.1 V operation match the board's memory controller requirements exactly. Administrators upgrading dense compute nodes use this kit to maximise installed memory without compatibility guesswork.
Thermals noise and power draw
Modules operate at the standard DDR5 1.1 V without added heat spreaders, relying on server chassis airflow for cooling. Registered buffering reduces electrical load on the memory controller, helping maintain stable operation when all sixteen slots are populated. Power consumption scales with the 5600 MT/s data rate and 256 GB total capacity under typical enterprise workloads. Acoustic output is determined by the system fans rather than the memory itself.
Sixteen-module population rule
The kit provides sixteen RDIMMs to fill every DIMM slot on the supported motherboard, so the single specification that decides fitment is whether your system manual approves a fully populated 1Rx8 configuration at DDR5 5600. If the platform limits rank-per-channel or total capacity below 256 GB, the modules will not run as intended. Verify the approved population order and maximum supported density before purchase.
Prednosti
- 256 GB capacity from 16 matched 16 GB modules
- DDR5 5600 speed with CL46 latency runs at rated frequency
- Registered ECC architecture corrects single-bit errors for server stability
- 1 V low-voltage operation matches platform requirements exactly
- 288-pin RDIMM form factor fits Supermicro H13DSG-O-CPU motherboard
Špecifikácie
| Brand | NEMIX RAM |
|---|---|
| Series | NEMIX RAM Original Series Server Memory |
| Model | DDR5 ECC RDIMM Registered Server Memory |
| Part Number | MR44800-618K16 |
| Capacity | 256GB (16 x 16GB) |
| Type | 288-Pin DDR5 RDIMM |
| Speed | DDR5 5600 (PC5 44800) |
| CAS Latency | CL46 |
| Voltage | 1.10V |
| ECC | Yes |
| Buffered/Registered | Registered |
| Rank | 1Rx8 |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Heat Spreader | No |
| Compatible System | Supermicro |
| Features | DDR5 ECC RDIMM Motherboard Compatible |
| Package Content | 256GB 16X16GB DDR5 5600MHz PC5-44800 1Rx8 1.1V 288-PIN ECC RDIMM KIT |
Otázky k tomuto produktu
How do I install the 16 DDR5 RDIMMs into the Supermicro H13DSG-O-CPU, and which population order do people get wrong?
Fill all 16 slots following the motherboard manual's exact DIMM population sequence for 1Rx8 registered modules; the common mistake is skipping the prescribed order, which prevents the 256 GB kit from being recognised at DDR5 5600 speed.
What maintenance or replacement will the 256 GB DDR5 ECC RDIMM kit need during its service life?
No routine maintenance is required; the registered ECC design corrects single-bit errors automatically, and the modules are covered by a lifetime replacement warranty if a fault ever develops.
What limit appears first when the 16-module kit runs sustained workloads at DDR5 5600 CL46?
The memory controller's maximum supported capacity and rank-per-channel limit is reached first; with 16 x 1Rx8 RDIMMs at 1.1 V the board runs fully populated at rated speed, so thermal or voltage headroom is not the bottleneck.
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