HP ProDesk 600 G3 SFF all-in-one PC i7-6700 3.40GHz 32GB DDR4 2TB SSD Windows 10 Pro
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Supermicro
2U AI/ML/HPC rack server with dual NVIDIA Grace 72-core CPUs, 480GB LPDDR5X memory, 3.84TB and 960GB SSDs, plus two L40S GPUs with 48GB GDDR6 each
The Supermicro ARS-221GL-NR-OTO-33 is a 2U rackmount server built around the NVIDIA Grace Superchip with dual 72-core CPUs and 480GB of LPDDR5X memory. It targets AI, machine learning and HPC workloads that demand high memory bandwidth and GPU acceleration in a compact form factor.
Two NVIDIA L40S GPUs each provide 48GB of GDDR6 memory for training and inference tasks. Storage combines a 3.84TB E1.S EDSFF SSD with a 960GB M.2 SSD, while eight front hot-swap E1.S bays allow additional NVMe capacity to be added without downtime.
The system uses air cooling rated for up to 500W TDP CPUs, so adequate rack airflow is essential. Installers must verify that the 25GbE SFP28 networking matches existing switch ports and that the operating temperature range of 10°C to 35°C can be maintained in the target environment.
| Brand | SUPERMICRO |
|---|---|
| Model | ARS-221GL-NR-OTO-33 |
| Workload | AI/ML/HPC Server |
| Type | Rack |
| Rack Height | 2U |
| CPU Type | NVIDIA Grace Superchip |
| Number of CPU Cores | 72-Core Processor |
| CPU Features | Supports up to 500W TDP CPUs (Air Cooled) |
| Chipset | NVIDIA C2 |
| Installed Memory Size | 480GB |
| Memory Type | LPDDR5X |
| SSD (Installed) | 3.84TB + 960GB |
| GPU Type | 2 x NVIDIA Ada L40S |
| Video Memory | 48GB GDDR6 |
| Ethernet Controller | 1 x Standard NVIDIA 25GbE with 2 SFP28 ports |
| Expansion Bays | 8 front hot-swap E1.S NVMe drive bay(s) |
| Temperature | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) |
| Humidity | Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
| Dimensions | 3.46" x 17.25" x 35.43" |
| Weight | 67.5 lbs. |
| Prepravná hmotnosť | 29.71 kg |
| Rozmery balenia | 1219 × 711 × 241 mm |
The 480GB LPDDR5X memory is soldered directly to the Grace Superchip package and cannot be removed, upgraded or replaced separately.
The air-cooled thermal design is rated for up to 500W TDP CPUs; sustained full-load operation will hit the cooling capacity before other subsystems become the bottleneck.
With dual L40S GPUs and a 500W TDP CPU limit, the system moves a large volume of air through the 2U chassis; expect significant fan noise and exhaust heat that requires adequate rack airflow.
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