Thermal Grizzly Minus Pad 8 thermal pad 120 × 20 × 1.5 mm
- 8.0 W/mK
- -100 °C to +250 °C
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Thermal Grizzly
High-conductivity 8.0 W/mK silicone pad fills gaps between heatsinks and chips in PCs or consoles
Option 20 x 120 x 0.5 mm - 2 pcs
Thermal Grizzly Minus Pad 8 is a modified silicone thermal pad filled with metal oxides. It provides 8.0 W/mK thermal conductivity for transferring heat between a component and its heatsink. The pad remains flexible across a long-term operating range of -100 °C to +250 °C. Two pieces are supplied for multiple applications.
This pad suits desktop PC, laptop and console owners who need a conformable interface for uneven surfaces or wide gaps where thermal paste would not bridge. It is not suited for buyers who require a liquid compound for microscopic contact or those needing a specific thickness not offered here.
The single specification that determines suitability is the 8.0 W/mK thermal conductivity rating. Match this value to the thermal resistance budget of your assembly to confirm the pad will dissipate enough heat for the target component.
| Brand | Thermal Grizzly |
|---|---|
| Series | Minus Pad 8 |
| Model | TG-MP8-120-20-05 2R |
| Part Number | TG-MP8-120-20-05-2R |
| Thermal Conductivity | 8.0 W/mK |
| Long Term Operating Temperature | -100 °C to +250 °C |
| Features | Description: Thermal Grizzly Minus Pad is a thermal pad made from modified silicone. The silicone is filled with metal oxides, thus ensuring remarkable thermal conductivity. Properties: The Thermal Grizzly Minus Pad 8 is a soft gap filler, which is adhesive but easy to remove. The Thermal Grizzly Minus Pad 8 is insulating and sports very high thermal conductivity, even with very little contact pressure. Standard Colour: The colour is a red-brown. Shipping: The Thermal Grizzly Minus Pad 8 is currently available for end users in the following sizes: 100mm x 100mm, 120mm x 20mm and 30mm |
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Each pad measures 120 mm by 20 mm, giving a thin rectangular sheet that fits tight gaps around VRMs, memory modules or console APUs.
Peel the protective liner from one face, press the exposed adhesive onto the component, then remove the second liner before seating the heatsink; either orientation works because both sides conduct equally.
The pad is rated for continuous operation from -100 °C to +250 °C and does not dry out like paste, so plan on swapping it only when you disassemble the heatsink for a major upgrade or cleaning.
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