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Two rectangular grey thermal pads 120 by 20 mm on a white background

Thermal Grizzly

Thermal Grizzly Minus Pad 8 thermal pad 120 × 20 mm 2 pcs

SKU CH-Z8RV-ZSH0N

High-conductivity 8.0 W/mK silicone pad fills gaps between heatsinks and chips in PCs or consoles

  • Thermal Conductivity8.0 W/mK
  • Long Term Operating Temperature-100 °C to +250 °C
  • FeaturesDescription: Thermal Grizzly Minus Pad is a thermal pad made

Option 20 x 120 x 0.5 mm - 2 pcs

  • High 8.0 W/mK conductivity moves heat fast
  • Flexible silicone fills microscopic gaps between surfaces
  • Self-adhesive backing simplifies installation on uneven substrates
  • Operates reliably from -100 °C to +250 °C
  • Two 120 × 20 mm pads cover multiple components

Thermal Grizzly Minus Pad 8 silicone pad

Thermal Grizzly Minus Pad 8 is a modified silicone thermal pad filled with metal oxides. It provides 8.0 W/mK thermal conductivity for transferring heat between a component and its heatsink. The pad remains flexible across a long-term operating range of -100 °C to +250 °C. Two pieces are supplied for multiple applications.

Suits builders replacing paste where gaps are large

This pad suits desktop PC, laptop and console owners who need a conformable interface for uneven surfaces or wide gaps where thermal paste would not bridge. It is not suited for buyers who require a liquid compound for microscopic contact or those needing a specific thickness not offered here.

8.0 W/mK conductivity decides fit

The single specification that determines suitability is the 8.0 W/mK thermal conductivity rating. Match this value to the thermal resistance budget of your assembly to confirm the pad will dissipate enough heat for the target component.

Punti di forza

  • High 8.0 W/mK conductivity moves heat fast
  • Flexible silicone fills microscopic gaps between surfaces
  • Self-adhesive backing simplifies installation on uneven substrates
  • Operates reliably from -100 °C to +250 °C
  • Two 120 × 20 mm pads cover multiple components

Caratteristiche tecniche

BrandThermal Grizzly
SeriesMinus Pad 8
ModelTG-MP8-120-20-05 2R
Part NumberTG-MP8-120-20-05-2R
Thermal Conductivity8.0 W/mK
Long Term Operating Temperature-100 °C to +250 °C
FeaturesDescription: Thermal Grizzly Minus Pad is a thermal pad made from modified silicone. The silicone is filled with metal oxides, thus ensuring remarkable thermal conductivity.
Properties: The Thermal Grizzly Minus Pad 8 is a soft gap filler, which is adhesive but easy to remove. The Thermal Grizzly Minus Pad 8 is insulating and sports very high thermal conductivity, even with very little contact pressure.
Standard Colour: The colour is a red-brown.
Shipping: The Thermal Grizzly Minus Pad 8 is currently available for end users in the following sizes: 100mm x 100mm, 120mm x 20mm and 30mm

Altre versioni di questo modello

altri 2 nella stessa gamma

Stessa famiglia, con memoria, dissipatore o frequenza diversi — confronti prima di decidere.

Domande su questo articolo

What are the exact dimensions of each Minus Pad 8 sheet so I can check clearance in my device?

Each pad measures 120 mm by 20 mm, giving a thin rectangular sheet that fits tight gaps around VRMs, memory modules or console APUs.

The pad is self-adhesive — do I peel a liner or apply it dry, and which side touches the heatsink?

Peel the protective liner from one face, press the exposed adhesive onto the component, then remove the second liner before seating the heatsink; either orientation works because both sides conduct equally.

How often should I replace the Minus Pad 8 in a gaming laptop that runs hot daily?

The pad is rated for continuous operation from -100 °C to +250 °C and does not dry out like paste, so plan on swapping it only when you disassemble the heatsink for a major upgrade or cleaning.

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