EN-Labs Copper Heatsink Kit for Raspberry Pi 4 Model B (2019)

Copper heatsink kit for Raspberry Pi 4 2019

This set contains four copper heatsinks sized for the processor, LAN controller and power-management chip on the 2019 Raspberry Pi 4 Model B. Each piece ships with thermal conductive adhesive tape already applied, so installation is a simple peel-and-stick operation. The kit targets the board's main hot-spots to enlarge the dissipation area without adding active cooling. It suits hobbyists and embedded developers who need silent thermal relief for the stock board.

Passive cooling limits on a bare board

Copper conducts heat well, but without forced airflow the heatsinks rely entirely on natural convection and the case environment. In a sealed enclosure or under sustained heavy load the temperature drop will be modest compared with a fan-assisted solution. The adhesive bond also depends on clean, flat surfaces; any unevenness on the chip packages can reduce contact quality. Buyers expecting dramatic temperature reductions under continuous full-load scenarios should be aware of these passive constraints.

Build quality and everyday handling

The heatsinks are cut from solid copper and carry a factory-applied thermal tape that resists drying out over typical operating temperatures. Their low profile keeps the board compatible with most standard Raspberry Pi cases, though very tight enclosures may press against the tallest sink. Because the adhesive is permanent, repositioning after placement risks weakening the bond, so alignment must be decided before contact. The kit also works on other small ICs such as VRAM or MOSFETs, but the supplied sizes are optimised for the Pi 4 layout.