NEMIX RAM DDR5-5600 2TB (16x128GB) ECC RDIMM CL46 1.1V Supermicro H14SST-G memory upgrade
- 2TB (16 x 128GB)
- 288-Pin DDR5 RDIMM
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GIGABYTE
AM4 ATX board with 12+2 phase digital VRM, dual PCIe 4.0 M.2 slots, Wi-Fi 6, Intel gigabit LAN, and RGB Fusion 2.0 lighting
This AMD X570 board uses the AM4 socket and supports Ryzen 5000 series processors after a BIOS update. Four DDR4 slots accept up to 128 GB in dual-channel mode. Two PCIe 4.0 x16 slots and two PCIe 4.0 x1 slots provide expansion room. Dual M.2 sockets with thermal guards support PCIe 4.0 x4 drives. Intel Wi-Fi 6 and 1 GbE LAN handle networking. Realtek ALC1220-VB audio delivers 114 dB rear SNR.
A 12+2 phase IR digital VRM with PowIRstage components feeds the CPU. The Fins-Array heatsink and direct-touch heatpipe spread VRM heat without active cooling. Smart Fan 5 reads multiple sensors and can stop chassis fans at low load. Idle power draw stays modest thanks to the efficient VRM design. Acoustic profile remains quiet during office work and media playback.
The VRM heatsink mass absorbs heat during long renders or compiles, delaying temperature rise. Fan curves ramp gradually as VRM and chipset sensors climb. PCIe 4.0 M.2 guards keep SSD throttling in check during large transfers. Memory stability holds at rated DDR4 speeds during extended sessions. The board maintains consistent throughput without protective downclocking.
| Brand | GIGABYTE |
|---|---|
| Model | X570 AORUS PRO WIFI |
| CPU Socket Type | AM4 |
| CPU Type | Ryzen 5000 Series |
| Chipset | AMD X570 |
| Number of Memory Slots | 4x288pin (DDR4) |
| Memory Standard | 3rd Generation AMD Ryzen processors: Support for DDR4 4400(O.C.)/ 4300(O.C.)/ 4266(O.C.)/ 4133(O.C.)/ 4000(O.C.)/ 3866(O.C.)/ 3800(O.C.)/ 3733(O.C.)/ 3600(O.C.)/ 3466(O.C.)/ 3400(O.C.)/ 3333(O.C.)/ 3300(O.C.)/ 3200/ 2933/ 2667/ 2400/ 2133 MHz memory modules 2nd Generation AMD Ryzen processors / AMD Ryzen with Radeon Vega Graphics processors: Support for DDR4 3600(O.C.)/ 3400(O.C.)/ 3333(O.C.)/ 3200(O.C.)/ 2933/ 2667/ 2400/ 2133 MHz memory modules |
| Maximum Memory Supported | 128GB |
| Channel Supported | Dual Channel |
| PCI Express 4.0 x16 | Integrated in the CPU (PCIEX16/PCIEX8): 3rd Generation AMD Ryzen processors: 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16 (PCIEX16) 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x8 (PCIEX8) 2nd Generation AMD Ryzen processors: 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x16 (PCIEX16) 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x8 (PCIEX8) * For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot. * The PCIEX8 slot shares bandwidth with the PCIEX16 |
| PCI Express x1 | 2 x PCI Express x1 slots, supporting PCIe 4.0*/3.0 * For 3rd Generation AMD Ryzen processors only. |
| Serial ATA (SATA) | 6 x SATA 6Gb/s |
| M.2 | Integrated in the CPU (M2A_SOCKET): 3rd Generation AMD Ryzen processors: 1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 4.0 x4/x2 SSD support) 2nd Generation AMD Ryzen processors / 2nd Generation AMD Ryzen with Radeon Vega Graphics processors / AMD Ryzen with Radeon Vega Graphics processors: 1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 3.0 x4/x2 SSD support) Integrated in the Chipset (M2B_SOCKET): 1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 4.0*/3.0 x4/x2 SSD support) * For 3rd Generation AMD |
| SATA RAID | 0/1/10 |
| Onboard Video Chipset | Integrated Graphics Processor: 1 x HDMI port, supporting a maximum resolution of 4096x2160@60Hz * Support for HDMI 2.0 version, HDCP 2.2, and HDR. Maximum shared memory of 16GB Note: For 2nd Generation AMD Ryzen with Radeon Vega Graphics processors / AMD Ryzen with Radeon Vega Graphics processors only. |
| Audio Chipset | Realtek ALC1220-VB * The back panel line out jack supports DSD audio. |
| Audio Channels | 2/4/5.1/7.1-channel Support for S/PDIF Out |
| LAN Chipset | Intel GbE LAN chip |
| Max LAN Speed | 1Gbps |
| Wireless LAN | Wi-Fi 802.11 a/b/g/n/ac/ax, supporting 2.4/5 GHz Dual-Band Support for 11 ax 160 MHz wireless standard and up to 2.4 Gbps data rate * Actual data rate may vary depending on environment and equipment. |
| Bluetooth | BLUETOOTH 5.0 |
| Back I/O Ports | 2 x SMA antenna connectors (2T2R) 1 x HDMI port 1 x USB Type-C port, with USB 3.2 Gen 2 support 1 x USB 3.2 Gen 2*/Gen 1 Type-A port (red) * For 3rd Generation AMD Ryzen processors only. 1 x USB 3.2 Gen 2 Type-A port (red) 3 x USB 3.2 Gen 1 ports 4 x USB 2.0/1.1 ports 1 x RJ-45 port 1 x optical S/PDIF Out connector 5 x audio jacks |
| Onboard USB | 1 x USB Type-C port, with USB 3.2 Gen 2 support 2 x USB 3.2 Gen 1 headers 2 x USB 2.0/1.1 headers |
| Other Connectors | 1 x CPU fan header 1 x water cooling CPU fan header 3 x system fan headers 2 x system fan/water cooling pump headers 2 x addressable LED strip headers 2 x RGB LED strip headers 1 x CPU cooler LED strip/RGB LED strip header 1 x front panel header 1 x front panel audio header 1 x Trusted Platform Module (TPM) header (2x6-pin, for the GC-TPM2.0_S module only) 1 x Clear CMOS jumper 2 x temperature sensor headers 1 x Q-Flash Plus button |
| Form Factor | ATX |
| LED Lighting | RGB |
| Dimensions (W x L) | 12.0" x 9.6" |
| Power Pin | 1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector 1 x 4-pin ATX 12V power connector |
| Windows 11 | Supported |
| Features | Multi-Graphics Technology: Support for NVIDIA Quad-GPU SLI and 2-Way NVIDIA SLI technologies Support for AMD Quad-GPU CrossFire and 2-Way AMD CrossFire technologies Note: For 3rd Generation AMD Ryzen processors / 2nd Generation AMD Ryzen processors only. I/O Controller: iTE I/O Controller Chip H/W Monitoring: Voltage detection Temperature detection Fan speed detection Water cooling flow rate detection Overheating warning Fan fail warning Fan speed control * Whether the fan (pump) speed control function is supported will depend on the fan (pump) you install. BIOS: 2 x 128 Mbit flash U |
Align the gold triangle on the Ryzen processor with the socket corner marker, lower it gently without force, then close the retention arm until it clicks. The AM4 socket uses a zero-insertion-force design; the common error is pressing down before the arm is fully latched.
The Fins-Array Heatsink with Direct Touch Heatpipe handles VRM cooling; under sustained high current the thermal pads between the heatsink and PowIRstage MOSFETs can dry out and should be replaced to maintain contact.
The Dual Thermal Guards on the two M.2 connectors saturate first, causing the SSD controllers to throttle to protect the 4.0 x4 link. Adding case airflow over the guards delays this limit.
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