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ASUS

ASUS B860M AYW GAMING WIFI + Ultra 9 285K Intel motherboard combo

SKU CH-3CSB-P7N4C

Bundled Intel Core Ultra 9 285K processor with LGA 1851 motherboard, DDR5 support up to 7600 speeds, dual M.2 slots reaching 128Gbps, WiFi 6, 2.5Gb LAN and included Shin-Etsu thermal grease

  • CPU Socket TypeLGA 1851

+CPU +Ultra 9 285K

  • Ready-to-build bundle includes motherboard, CPU and Shin-Etsu X-23-7868-2D thermal paste
  • 36 MB L3 plus 40 MB L2 cache accelerate compute-heavy workloads
  • DDR5 AEMP 3.0 unlocks speeds beyond 7600 MT/s for faster memory throughput
  • Dual M.2 slots with heatsinks deliver up to 128 Gbps storage bandwidth
  • WiFi 6 and 2.5 Gb LAN plus rear USB 10 Gbps Type-A keep connections fast

Ready-to-build Intel bundle

This package pairs an ASUS B860M AYW GAMING WIFI motherboard with an Intel Core Ultra 9 285K processor and a tube of Shin-Etsu X-23-7868-2D thermal paste. The board uses the LGA 1851 socket and the micro-ATX form factor. It is aimed at builders who want a matched CPU and board in one purchase.

Suited for compact DDR5 systems

The combination fits micro-ATX cases and supports DDR5 memory with AEMP 3.0 for speeds beyond 7600. Dual M.2 slots provide PCIe 5.0 x4 and PCIe 4.0 x4 storage paths. WiFi 6 and 2.5Gb LAN handle networking. Builders needing full-size ATX or more than two M.2 drives should consider other platforms.

Straightforward assembly with pre-fitted I/O shield

The motherboard ships with the I/O shield already mounted, saving a fiddly step. SafeSlot Core+ reinforces the primary PCIe slot for heavy graphics cards. Apply the included gray paste evenly; its 6.2 W/m.k conductivity and 0.07 °C·cm²/W resistance are rated for easy application and a two-year refresh cycle.

Fordele

  • Ready-to-build bundle includes motherboard, CPU and Shin-Etsu X-23-7868-2D thermal paste
  • 36 MB L3 plus 40 MB L2 cache accelerate compute-heavy workloads
  • DDR5 AEMP 3.0 unlocks speeds beyond 7600 MT/s for faster memory throughput
  • Dual M.2 slots with heatsinks deliver up to 128 Gbps storage bandwidth
  • WiFi 6 and 2.5 Gb LAN plus rear USB 10 Gbps Type-A keep connections fast

Specifikationer

BrandASUS
ModelB860M AYW GAMING WIFI+Ultra 9 285K
CPU Socket TypeLGA 1851

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Spørgsmål om denne vare

Will the pre-mounted I/O shield fit a standard micro-ATX case cut-out?

Yes. The shield is built to the standard micro-ATX layout so it aligns with the rear panel opening on any compatible chassis.

Does the Intel Ultra 9 285K include a cooler in this combo?

No. The processor is sold without a cooling device; you must supply your own CPU cooler.

What thermal paste performance figures apply to the included Shin-Etsu grease?

The paste has a thermal conductivity of 6.2 W/m·k, thermal resistance of 0.07 °C·cm²/W and a viscosity of 100 Pa·s.

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