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ATX motherboard in silver and black with large heatsinks and rear I/O shield

GIGABYTE

GIGABYTE B860 EAGLE WIFI6E Intel motherboard

SKU CH-8CGD-TH7P9 MPN B860 EAGLE WIFI6E

ATX board for Intel Core Ultra Series 2 CPUs on LGA 1851 with four DDR5 slots up to 256 GB, PCIe 5.0 x16, three M.2 sockets, 2.5 GbE LAN, WIFI6E and BLUETOOTH 5.3

  • CPU Socket TypeLGA 1851
  • CPU TypeIntel Core Ultra Processors (Series 2)
  • ChipsetIntel B860
  • Number of Memory Slots4x288pin (DDR5)
  • Memory StandardDDR5 5600 / DDR5 6400 / DDR5 6600 / DDR5 6800 / DDR5 7000 /
  • Maximum Memory Supported256GB

Option B860 EAGLE WIFI6E

De overstregede versioner findes, men er ikke på lager her.

  • Supports Intel Core Ultra Series 2 processors via LGA 1851 socket
  • Four DDR5 slots deliver up to 256 GB capacity with XMP 3.0 profiles
  • 12+1+2+1 phase VRM with 50 A PPAK stages ensures stable CPU power delivery
  • PCIe 5.0 x16 slot plus three M.2 connectors for high-speed storage expansion
  • WIFI6E and 2.5 GbE LAN plus Bluetooth 5.3 provide fast wireless and wired connectivity

Intel Core Ultra (Series 2) LGA 1851 ATX board

The GIGABYTE B860 EAGLE WIFI6E accepts Intel Core Ultra Series 2 processors in the LGA 1851 socket. Four DDR5 slots support up to 256 GB in dual-channel mode with XMP 3.0 profiles. PCIe 5.0 x16 from the CPU and three M.2 connectors provide high-speed expansion for graphics and storage.

12+1+2+1 VRM with MOSFET and M.2 heatsinks

A 12+1+2+1 phase digital VRM uses 50 A PPAK stages for VCORE, a 40 A DrMOS stage for VCCGT and two PPAK stages for VCCSA. MOSFET heatsinks cover the power delivery area while an M.2 Thermal Guard covers the primary CPU-attached slot. The design targets steady thermals under sustained multi-core loads.

EZ-Latch slots, WIFI EZ-Plug antenna and AI software

M.2 EZ-Latch and PCIe EZ-Latch let you install SSDs and graphics cards without tools. WIFI EZ-Plug simplifies the external antenna connection for WIFI6E and BLUETOOTH 5.3. Bundled software includes AI SNATCH for automated DDR5 overclocking up to 9066 MT/s and HyperTune BIOS for AI-driven signal optimisation.

Fordele

  • Supports Intel Core Ultra Series 2 processors via LGA 1851 socket
  • Four DDR5 slots deliver up to 256 GB capacity with XMP 3.0 profiles
  • 12+1+2+1 phase VRM with 50 A PPAK stages ensures stable CPU power delivery
  • PCIe 5.0 x16 slot plus three M.2 connectors for high-speed storage expansion
  • WIFI6E and 2.5 GbE LAN plus Bluetooth 5.3 provide fast wireless and wired connectivity

Specifikationer

BrandGIGABYTE
ModelB860 EAGLE WIFI6E
CPU Socket TypeLGA 1851
CPU TypeIntel Core Ultra Processors (Series 2)
ChipsetIntel B860
Number of Memory Slots4x288pin (DDR5)
Memory StandardDDR5 5600 / DDR5 6400 / DDR5 6600 / DDR5 6800 / DDR5 7000 / DDR5 7200 / DDR5 7400 / DDR5 7600 / DDR5 7800 / DDR5 7900 / DDR5 7950 / DDR5 8000 / DDR5 8200 / DDR5 8266 / DDR5 8400 / DDR5 8600 / DDR5 8800 / DDR5 9066
Maximum Memory Supported256GB
Channel SupportedDual Channel
Memory Performance ProfileIntel XMP 3.0
Memory FeatureDual channel memory architecture
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
Support for Extreme Memory Profile (XMP) memory modules
PCI Express 5.0 x16CPU:
- 1 x PCI Express x16 slot, supporting PCIe 5.0 and running at x16 (PCIEX16)
* The PCIEX16 slot can only support a graphics card or an NVMe SSD. If only one graphics card is to be installed, be sure to install it in the PCIEX16 slot.
PCI Express 4.0 x16Chipset:
- 2 x PCI Express x16 slots, supporting PCIe 4.0 and running at x1(PCIEX1_3/4)
Serial ATA (SATA)4 x SATA 6Gb/s
M.2CPU:
- 1 x M.2 connector (Socket 3, M key, type 25110/22110/2580/2280 PCIe 5.0x4/x2 SSD support) (M2A_CPU)
Chipset:
- 1 x M.2 connector (Socket 3, M key, type 25110/22110/2580/2280 PCIe 4.0x4/x2 SSD support) (M2Q_SB)
- 1 x M.2 connector (Socket 3, M key, type 25110/22110/2580/2280 PCIe 4.0x4/x2 SSD support) (M2P_SB)
SATA RAIDRAID 0, RAID 1, RAID 5, and RAID 10 support for SATA storage devices
Audio Channels7.1 Channels
Max LAN Speed2.5Gbps
Wireless LANWi-Fi 802.11 ax
BluetoothBLUETOOTH 5.3
Back I/O Ports1 x PS/2 keyboard/mouse port
1 x HDMI port (Note)
1 x DisplayPort (Note)
1 x USB Type-C port, with USB 3.2 Gen 2x2 support
1 x USB 3.2 Gen 2 Type-A port (red)
4 x USB 2.0/1.1 ports
2 x antenna connectors (2T2R)
1 x RJ-45 port
3 x audio jacks
Onboard USB1 x USB Type-C header, with USB 3.2 Gen 1 support
1 x USB 3.2 Gen 1 header
2 x USB 2.0/1.1 headers
Other Connectors1 x CPU fan header
1 x CPU fan/water cooling pump header
2 x system fan headers
2 x system fan/water cooling pump headers
3 x addressable RGB Gen2 LED strip headers
1 x RGB LED strip header
3 x M.2 Socket 3 connectors
4 x SATA 6Gb/s connectors
1 x front panel header
1 x front panel audio header
1 x S/PDIF Out header
1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0/GC-TPM2.0 SPI V2 module only)
1 x serial port header
1 x Q-Flash Plus button
1 x reset jumper
1 x Clear CMOS jumper
BIOS Feature1 x 256 Mbit flash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Form FactorATX
Dimensions (W x L)12.0" x 9.6"
Power Pin1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
Forsendelsesvægt1.68 kg
Pakkestørrelse356 × 279 × 102 mm

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Spørgsmål om denne vare

How is the M.2 SSD installed using the EZ-Latch mechanism, and what step do builders often miss?

Remove the screw, slide the SSD into the M-keyed slot at a slight angle, press it flat, then secure it with the EZ-Latch clip; the step often missed is pressing the drive fully down before engaging the latch so the connector seats evenly.

What maintenance or replacement will the Wi-Fi 6E and Bluetooth 5.3 module need later?

The module is soldered to the board and has no user-serviceable parts; keep the antenna connectors tight and update drivers through the OS — if the radio fails the board requires professional repair.

What thermal limit appears first on the VRM heatsink during sustained all-core loads?

The 12+1+2+1 phase VRM with 50 A PPAK stages is cooled by a single MOSFET heatsink; under heavy continuous current the heatsink saturates first, causing the VRM to throttle before the CPU reaches its own thermal ceiling.

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