BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
Me võtame vastu krüptoraha — nii saab teie hoitav krüptoraha osta päris riistvara.Makske krüptorahaga, kulutage seda päris riistvarale. Tasuta kindlustatud tarne kogu maailmas, üle 399 $. Lihtsad, kaubamärgita väliskarbid, saadetud Saksamaalt.Tasuta kindlustatud tarne üle 399 $. Teie kurss lukustatakse 30 minutiks kohe, kui kassa avaneb.Kurss lukustatud 30 minutiks. Iga toode on pitseeritud, selle seerianumber on kontrollitud ja sellel kehtib 24-kuuline garantii.Pitseeritud, 24-kuulise garantiiga.
G.SKILL
Dual-channel 8GB DDR3 kit running at 1600MHz with CL9 timing and 1.50V operation for Intel LGA1155/LGA1156 and AMD AM3/Llano/AM3+ platforms
This G.SKILL Ares Series kit provides 8GB of desktop memory across two 4GB modules. It runs at DDR3 1600 with CL9 9-9-9-24 timings at 1.50V. The orange heat spreaders help dissipate heat during operation. It is an unbuffered, non-ECC dual-channel kit built for older platforms.
The kit is designed for Intel LGA1155, LGA1156 and AMD AM3, Llano, AM3+ platforms with XMP support for 1st, 2nd and 3rd Generation Intel Core processors. Systems requiring ECC or registered modules cannot use this memory. Builders needing higher capacity or a different DDR generation must choose another product.
The decisive specification is the DDR3 1600 (PC3 12800) rating combined with CL9 9-9-9-24 timing at 1.50V. This speed and latency profile determines whether the kit matches the motherboard's supported memory standard. Verify the platform requires DDR3 before purchasing.
| Brand | G.SKILL |
|---|---|
| Series | Ares Series |
| Model | F3-1600C9D-8GAO |
| Capacity | 8GB (2 x 4GB) |
| Speed | DDR3 1600 (PC3 12800) |
| CAS Latency | CL9 |
| Timing | 9-9-9-24 |
| Voltage | 1.50V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Multi-channel Kit | Dual Channel Kit |
| Color | Orange |
| Heat Spreader | Yes |
| Features | Compatible with Intel LGA1155/LGA1156 and AMD AM3/Llano/AM3+ platforms Intel XMP support for 1st, 2nd and 3rd Generation Intel Core Processors |
| Tarnekaal | 0.11 kg |
| Pakendi mõõtmed | 216 × 140 × 25 mm |
Yes, the kit is designed for Intel LGA1155 and LGA1156 platforms as well as AMD AM3, Llano and AM3+ sockets.
The modules are rated for 1.50 V and support Intel XMP on 1st, 2nd and 3rd Generation Intel Core processors for automatic configuration.
CL9 with 9-9-9-24 timings at DDR3 1600 provides low latency for responsive gaming and multitasking on supported platforms.
Veel samast osakonnast
Sama osakond, sama kassa — kaheksa krüptovaluutat ja 30-minutiline kursilukk.
See, millega maksate, ja see, milles vaatate hindu.
Saadetud teie rahakotist kassas
Ainult kuvamiseks — kataloogi hinnad on dollarites
Ükski vääring ei vasta sellele.
Valige keel, milles sait teiega räägib.
Ükski keel ei vasta.
Esimest korda siin?
Teil on juba konto?
Automaatset lähtestamist ei ole: see pood ei saada ühtegi e-kirja, seega pole ka ühekordset linki, mida küsida. Jätke aadress kontole alles, seda käsitletakse käsitsi.
Päring registreeritud
Teie postkasti ei jõua midagi — see pood ei saada e-kirju üldse. Keegi tegeleb sellega käsitsi.
Tuli meelde?