BFKK
BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
214,99 USD
0.0028064BTC
Dostępny
G.SKILL
G.SKILL Ares Series 8GB (2 x 4GB) DDR3 1600 CL9 desktop RAM F3-1600C9D-8GAO
Dual-channel 8GB DDR3 kit running at 1600MHz with CL9 timing and 1.50V operation for Intel LGA1155/LGA1156 and AMD AM3/Llano/AM3+ platforms
- Capacity8GB (2 x 4GB)
- SpeedDDR3 1600 (PC3 12800)
- CAS LatencyCL9
- Timing9-9-9-24
- Voltage1.50V
- ECCNo
- Dual-channel 8GB kit doubles bandwidth for multitasking
- DDR3 1600 speed delivers fast data transfer for everyday computing
- CL9 9-9-9-24 timings reduce latency for responsive performance
- 50V operation lowers power draw and heat output
- Compatible with Intel LGA1155/LGA1156 and AMD AM3/Llano/AM3+ platforms
G.SKILL Ares Series 8GB DDR3 1600 Kit
This G.SKILL Ares Series kit provides 8GB of desktop memory across two 4GB modules. It runs at DDR3 1600 with CL9 9-9-9-24 timings at 1.50V. The orange heat spreaders help dissipate heat during operation. It is an unbuffered, non-ECC dual-channel kit built for older platforms.
Suits Intel LGA1155 and AMD AM3 builds
The kit is designed for Intel LGA1155, LGA1156 and AMD AM3, Llano, AM3+ platforms with XMP support for 1st, 2nd and 3rd Generation Intel Core processors. Systems requiring ECC or registered modules cannot use this memory. Builders needing higher capacity or a different DDR generation must choose another product.
DDR3 1600 speed and CL9 latency
The decisive specification is the DDR3 1600 (PC3 12800) rating combined with CL9 9-9-9-24 timing at 1.50V. This speed and latency profile determines whether the kit matches the motherboard's supported memory standard. Verify the platform requires DDR3 before purchasing.
Najważniejsze cechy
- Dual-channel 8GB kit doubles bandwidth for multitasking
- DDR3 1600 speed delivers fast data transfer for everyday computing
- CL9 9-9-9-24 timings reduce latency for responsive performance
- 50V operation lowers power draw and heat output
- Compatible with Intel LGA1155/LGA1156 and AMD AM3/Llano/AM3+ platforms
Specyfikacja
| Brand | G.SKILL |
|---|---|
| Series | Ares Series |
| Model | F3-1600C9D-8GAO |
| Capacity | 8GB (2 x 4GB) |
| Speed | DDR3 1600 (PC3 12800) |
| CAS Latency | CL9 |
| Timing | 9-9-9-24 |
| Voltage | 1.50V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Multi-channel Kit | Dual Channel Kit |
| Color | Orange |
| Heat Spreader | Yes |
| Features | Compatible with Intel LGA1155/LGA1156 and AMD AM3/Llano/AM3+ platforms Intel XMP support for 1st, 2nd and 3rd Generation Intel Core Processors |
| Waga przesyłki | 0.11 kg |
| Wymiary opakowania | 216 × 140 × 25 mm |
Pytania dotyczące tego produktu
Will this kit fit my Intel LGA1155 motherboard?
Yes, the kit is designed for Intel LGA1155 and LGA1156 platforms as well as AMD AM3, Llano and AM3+ sockets.
Does the memory run at 1.50 V without manual BIOS changes?
The modules are rated for 1.50 V and support Intel XMP on 1st, 2nd and 3rd Generation Intel Core processors for automatic configuration.
What do the timings 9-9-9-24 mean for real-world use?
CL9 with 9-9-9-24 timings at DDR3 1600 provides low latency for responsive gaming and multitasking on supported platforms.
Także w tym dziale
Klienci porównywali też te produkty
Ten sam dział, ta sama kasa — osiem kryptowalut i 30-minutowa blokada kursu.
BFKK
BFKK 2U Micro ATX Rackmount 2×5.25" 4×3.5" Side 80mm Fan
- Rackmount
216,99 USD
0.00283251BTC
Dostępny
