BFKK
BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
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G.SKILL
G.SKILL Ares Series 8GB (2 x 4GB) DDR3 1600 CL9 desktop RAM F3-1600C9D-8GAO
Dual-channel 8GB DDR3 kit running at 1600MHz with CL9 timing and 1.50V operation for Intel LGA1155/LGA1156 and AMD AM3/Llano/AM3+ platforms
- Capacity8GB (2 x 4GB)
- SpeedDDR3 1600 (PC3 12800)
- CAS LatencyCL9
- Timing9-9-9-24
- Voltage1.50V
- ECCNo
- Dual-channel 8GB kit doubles bandwidth for multitasking
- DDR3 1600 speed delivers fast data transfer for everyday computing
- CL9 9-9-9-24 timings reduce latency for responsive performance
- 50V operation lowers power draw and heat output
- Compatible with Intel LGA1155/LGA1156 and AMD AM3/Llano/AM3+ platforms
G.SKILL Ares Series 8GB DDR3 1600 Kit
This G.SKILL Ares Series kit provides 8GB of desktop memory across two 4GB modules. It runs at DDR3 1600 with CL9 9-9-9-24 timings at 1.50V. The orange heat spreaders help dissipate heat during operation. It is an unbuffered, non-ECC dual-channel kit built for older platforms.
Suits Intel LGA1155 and AMD AM3 builds
The kit is designed for Intel LGA1155, LGA1156 and AMD AM3, Llano, AM3+ platforms with XMP support for 1st, 2nd and 3rd Generation Intel Core processors. Systems requiring ECC or registered modules cannot use this memory. Builders needing higher capacity or a different DDR generation must choose another product.
DDR3 1600 speed and CL9 latency
The decisive specification is the DDR3 1600 (PC3 12800) rating combined with CL9 9-9-9-24 timing at 1.50V. This speed and latency profile determines whether the kit matches the motherboard's supported memory standard. Verify the platform requires DDR3 before purchasing.
Kohokohdat
- Dual-channel 8GB kit doubles bandwidth for multitasking
- DDR3 1600 speed delivers fast data transfer for everyday computing
- CL9 9-9-9-24 timings reduce latency for responsive performance
- 50V operation lowers power draw and heat output
- Compatible with Intel LGA1155/LGA1156 and AMD AM3/Llano/AM3+ platforms
Tekniset tiedot
| Brand | G.SKILL |
|---|---|
| Series | Ares Series |
| Model | F3-1600C9D-8GAO |
| Capacity | 8GB (2 x 4GB) |
| Speed | DDR3 1600 (PC3 12800) |
| CAS Latency | CL9 |
| Timing | 9-9-9-24 |
| Voltage | 1.50V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Multi-channel Kit | Dual Channel Kit |
| Color | Orange |
| Heat Spreader | Yes |
| Features | Compatible with Intel LGA1155/LGA1156 and AMD AM3/Llano/AM3+ platforms Intel XMP support for 1st, 2nd and 3rd Generation Intel Core Processors |
| Lähetyspaino | 0.11 kg |
| Pakkauksen mitat | 216 × 140 × 25 mm |
Kysymyksiä tästä tuotteesta
Will this kit fit my Intel LGA1155 motherboard?
Yes, the kit is designed for Intel LGA1155 and LGA1156 platforms as well as AMD AM3, Llano and AM3+ sockets.
Does the memory run at 1.50 V without manual BIOS changes?
The modules are rated for 1.50 V and support Intel XMP on 1st, 2nd and 3rd Generation Intel Core processors for automatic configuration.
What do the timings 9-9-9-24 mean for real-world use?
CL9 with 9-9-9-24 timings at DDR3 1600 provides low latency for responsive gaming and multitasking on supported platforms.
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BFKK
BFKK 2U Micro ATX Rackmount 2×5.25" 4×3.5" Side 80mm Fan
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