BFKK
BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
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G.SKILL
G.SKILL Ares F3-1600C10D-16GAO 16GB (2×8GB) DDR3 1600 CL10 desktop RAM
Dual-channel 16 GB kit with two 8 GB DDR3 1600 CL10 modules at 1.50 V and a 3.2 cm low-profile heat spreader
- Capacity16GB (2 x 8GB)
- SpeedDDR3 1600 (PC3 12800)
- CAS LatencyCL10
- Timing10-10-10
- Voltage1.50V
- ECCNo
- Low-profile 3.2 cm heat spreader fits compact builds and large CPU coolers
- 16 GB dual-channel kit (2 × 8 GB) boosts multitasking capacity
- DDR3 1600 speed with CL10 10-10-10 timing delivers responsive performance
- 50 V operation keeps power draw efficient
- Intel XMP support on LGA1155, LGA1156 and AMD AM3 platforms enables easy setup
Low-Profile DDR3 Kit
The G.SKILL Ares F3-1600C10D-16GAO provides 16GB of DDR3 memory in a dual-channel kit of two 8GB modules. It runs at 1600MHz with CL10 10-10-10 timings at 1.50V. The 3.2cm heat spreader fits small-form-factor builds and clears large CPU coolers. Compatibility covers Intel LGA1155 and LGA1156 plus AMD AM3 and AM3+ platforms with XMP support.
Sustained Load Behaviour
Extensive stress testing validates stability during prolonged workloads rather than brief bursts. The low-profile spreader dissipates heat to maintain rated 1600MHz speeds over long sessions. Unbuffered non-ECC operation ensures consistent throughput for desktop applications. The kit retains overclocking headroom above the standard PC3-12800 specification.
DDR3 Interface Limits
DDR3 topology caps transfer rates at the rated 1600MHz PC3-12800 ceiling. Dual-channel architecture doubles bandwidth over single-module configurations. CL10 latency represents the practical floor for this voltage and density combination. Manual BIOS tuning or the XMP profile is required to reach the advertised speed on supported platforms.
Kohokohdat
- Low-profile 3.2 cm heat spreader fits compact builds and large CPU coolers
- 16 GB dual-channel kit (2 × 8 GB) boosts multitasking capacity
- DDR3 1600 speed with CL10 10-10-10 timing delivers responsive performance
- 50 V operation keeps power draw efficient
- Intel XMP support on LGA1155, LGA1156 and AMD AM3 platforms enables easy setup
Tekniset tiedot
| Brand | G.SKILL |
|---|---|
| Series | Ares Series |
| Model | F3-1600C10D-16GAO |
| Capacity | 16GB (2 x 8GB) |
| Speed | DDR3 1600 (PC3 12800) |
| CAS Latency | CL10 |
| Timing | 10-10-10 |
| Voltage | 1.50V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Multi-channel Kit | Dual Channel Kit |
| Color | Orange |
| Heat Spreader | Yes |
| Features | Compatible with Intel LGA1155/LGA1156 and AMD AM3/Llano/AM3+ platforms Intel XMP support for 1st, 2nd and 3rd Generation Intel Core Processors To reach rated memory speed, enabling Intel XMP profile or manual BIOS tuning is required Combination with other memory kits or modules (even with same model number) is not recommended to avoid any compatibility issues |
| Lähetyspaino | 0.11 kg |
| Pakkauksen mitat | 206 × 133 × 18 mm |
Kysymyksiä tästä tuotteesta
Will the 3.2 cm tall heat spreader clear my large CPU cooler?
The modules measure 3.2 cm in height, which is low-profile by design. Measure the gap between your motherboard DIMM slots and the cooler base; if the clearance exceeds 3.2 cm the kit will fit without interference.
What BIOS setting is needed to run the kit at 1600 MHz CL10?
Enable the Intel XMP profile in the BIOS, or manually set the frequency to 1600 MHz, timings to 10-10-10 and voltage to 1.50 V. The kit is validated for XMP on 1st-3rd Gen Core platforms.
Is this kit compatible with an AMD AM3+ motherboard?
Yes. The specifications list compatibility with AMD AM3, AM3+ and Llano platforms, so the dual-channel kit will work on an AM3+ board running at the rated 1600 MHz CL10 settings.
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BFKK
BFKK 2U Micro ATX Rackmount 2×5.25" 4×3.5" Side 80mm Fan
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