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Two orange low-profile DDR3 desktop memory modules with heat spreaders

G.SKILL

G.SKILL Ares F3-1600C10D-16GAO 16GB (2×8GB) DDR3 1600 CL10 desktop RAM

SKU CH-KYM3-4GMNH MPN F3-1600C10D-16GAO

Dual-channel 16 GB kit with two 8 GB DDR3 1600 CL10 modules at 1.50 V and a 3.2 cm low-profile heat spreader

  • Capacity16GB (2 x 8GB)
  • SpeedDDR3 1600 (PC3 12800)
  • CAS LatencyCL10
  • Timing10-10-10
  • Voltage1.50V
  • ECCNo
  • Low-profile 3.2 cm heat spreader fits compact builds and large CPU coolers
  • 16 GB dual-channel kit (2 × 8 GB) boosts multitasking capacity
  • DDR3 1600 speed with CL10 10-10-10 timing delivers responsive performance
  • 50 V operation keeps power draw efficient
  • Intel XMP support on LGA1155, LGA1156 and AMD AM3 platforms enables easy setup

Low-Profile DDR3 Kit

The G.SKILL Ares F3-1600C10D-16GAO provides 16GB of DDR3 memory in a dual-channel kit of two 8GB modules. It runs at 1600MHz with CL10 10-10-10 timings at 1.50V. The 3.2cm heat spreader fits small-form-factor builds and clears large CPU coolers. Compatibility covers Intel LGA1155 and LGA1156 plus AMD AM3 and AM3+ platforms with XMP support.

Sustained Load Behaviour

Extensive stress testing validates stability during prolonged workloads rather than brief bursts. The low-profile spreader dissipates heat to maintain rated 1600MHz speeds over long sessions. Unbuffered non-ECC operation ensures consistent throughput for desktop applications. The kit retains overclocking headroom above the standard PC3-12800 specification.

DDR3 Interface Limits

DDR3 topology caps transfer rates at the rated 1600MHz PC3-12800 ceiling. Dual-channel architecture doubles bandwidth over single-module configurations. CL10 latency represents the practical floor for this voltage and density combination. Manual BIOS tuning or the XMP profile is required to reach the advertised speed on supported platforms.

Points forts

  • Low-profile 3.2 cm heat spreader fits compact builds and large CPU coolers
  • 16 GB dual-channel kit (2 × 8 GB) boosts multitasking capacity
  • DDR3 1600 speed with CL10 10-10-10 timing delivers responsive performance
  • 50 V operation keeps power draw efficient
  • Intel XMP support on LGA1155, LGA1156 and AMD AM3 platforms enables easy setup

Caractéristiques

BrandG.SKILL
SeriesAres Series
ModelF3-1600C10D-16GAO
Capacity16GB (2 x 8GB)
SpeedDDR3 1600 (PC3 12800)
CAS LatencyCL10
Timing10-10-10
Voltage1.50V
ECCNo
Buffered/RegisteredUnbuffered
Multi-channel KitDual Channel Kit
ColorOrange
Heat SpreaderYes
FeaturesCompatible with Intel LGA1155/LGA1156 and AMD AM3/Llano/AM3+ platforms
Intel XMP support for 1st, 2nd and 3rd Generation Intel Core Processors
To reach rated memory speed, enabling Intel XMP profile or manual BIOS tuning is required
Combination with other memory kits or modules (even with same model number) is not recommended to avoid any compatibility issues
Poids d’expédition0.11 kg
Dimensions du colis206 × 133 × 18 mm

Questions sur cet article

Will the 3.2 cm tall heat spreader clear my large CPU cooler?

The modules measure 3.2 cm in height, which is low-profile by design. Measure the gap between your motherboard DIMM slots and the cooler base; if the clearance exceeds 3.2 cm the kit will fit without interference.

What BIOS setting is needed to run the kit at 1600 MHz CL10?

Enable the Intel XMP profile in the BIOS, or manually set the frequency to 1600 MHz, timings to 10-10-10 and voltage to 1.50 V. The kit is validated for XMP on 1st-3rd Gen Core platforms.

Is this kit compatible with an AMD AM3+ motherboard?

Yes. The specifications list compatibility with AMD AM3, AM3+ and Llano platforms, so the dual-channel kit will work on an AM3+ board running at the rated 1600 MHz CL10 settings.

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