Hyväksymme kryptoa — hallussasi olevat kolikot voivat näin ostaa oikeaa laitteistoa.Maksa kryptolla, käytä se oikeaan laitteistoon. Ilmainen vakuutettu toimitus maailmanlaajuisesti yli 399 $. Neutraalit, tuotemerkittömät ulkopakkaukset, lähetetään Saksasta.Ilmainen vakuutettu toimitus yli 399 $. Kurssisi lukitaan 30 minuutiksi heti, kun kassa avautuu.Kurssi lukittu 30 minuutiksi. Jokainen tuote on sinetöity, sen sarjanumero on tarkistettu, ja sillä on 24 kuukauden takuu.Sinetöity, 24 kuukauden takuu.

Seuratut tuotteet Kirjaudu sisään
Grey thermal pad, rectangular 80 by 40 millimetres, 3.0 millimetres thick

GELID SOLUTIONS

GELID SOLUTIONS GP-Extreme 12W Thermal Pad 80x40x3.0mm

SKU CH-YGCW-V13GK

High-conductivity 12 W/mK thermal pad, 80 × 40 × 3.0 mm, non-conductive and non-curing for GPUs, laptops and dense PCBs

Option 80 x 40 x 3.0 mm

  • 12 W/mK thermal conductivity moves heat fast from hot components
  • Soft 3.0 mm pad fills uneven gaps on PCBs and memory ICs
  • Non-electrically conductive material prevents short circuits on dense boards
  • 80×40 mm sheet covers large GPU and laptop surfaces in one piece
  • Non-corrosive, non-curing and non-toxic formula stays stable over time

Purpose-built thermal pad

The GP-Extreme is a 12 W/mK thermal pad cut to 80 × 40 mm and 3.0 mm thick. It targets builders and technicians who need a soft, non-conductive interface for uneven PCB surfaces on graphics cards, laptops, consoles and dense SMD assemblies. The material is non-corrosive, non-hardening and non-toxic.

Capacity and headroom

At 12 W/mK the pad moves heat efficiently across typical MOSFET, memory IC and micro-controller heights, filling gaps up to its 3.0 mm thickness without excessive pressure. It runs out of headroom when the stack height exceeds that thickness or when a higher-conductivity paste is required for direct die contact.

Thickness selector

This specific SKU is the 3.0 mm variant; the same series also exists in 0.5, 1.0, 1.5 and 2.0 mm. Choose the thickness that matches the exact gap between component and heatsink — using a pad that is too thick or too thin will degrade thermal transfer.

Kohokohdat

  • 12 W/mK thermal conductivity moves heat fast from hot components
  • Soft 3.0 mm pad fills uneven gaps on PCBs and memory ICs
  • Non-electrically conductive material prevents short circuits on dense boards
  • 80×40 mm sheet covers large GPU and laptop surfaces in one piece
  • Non-corrosive, non-curing and non-toxic formula stays stable over time

Tekniset tiedot

BrandGELID Solutions

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Kysymyksiä tästä tuotteesta

Will the 3.0 mm thickness work with the uneven surface of my older GPU VRM heatsink?

The 3.0 mm pad is soft and compressible, designed to fill gaps on uneven PCB surfaces such as VRM modules, MOSFETs and memory ICs for full contact.

How can I verify the 12 W/mK thermal conductivity is performing after installation?

Monitor component temperatures under load; a drop compared to the previous interface material indicates the pad is conducting heat as specified.

Does the 80×40 mm sheet include any protective film or tools, or must I buy them separately?

The pack contains one 80×40 mm thermal pad only; no protective film, applicator or additional accessories are included.

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Sama osasto, sama kassa — kahdeksan kryptovaluuttaa ja 30 minuutin kurssilukko.