Wir akzeptieren Kryptowährungen — so können die Coins, die Sie besitzen, echte Hardware kaufen.Zahlen Sie mit Krypto, geben Sie sie für echte Hardware aus. Weltweit kostenloser versicherter Versand ab 399 $. Neutrale Kartons ohne Markenaufdruck, versendet aus Deutschland.Kostenloser versicherter Versand ab 399 $. Ihr Kurs wird 30 Minuten lang gesperrt, sobald die Kasse geöffnet wird.Kurs 30 Minuten gesperrt. Jeder Artikel ist versiegelt, die Seriennummer wird geprüft, und es gilt eine Garantie von 24 Monaten.Versiegelt, 24 Monate Garantie.

Gemerkte Artikel Anmelden
Grey thermal pad, rectangular 80 by 40 millimetres, 3.0 millimetres thick

GELID SOLUTIONS

GELID SOLUTIONS GP-Extreme 12W Thermal Pad 80x40x3.0mm

SKU CH-YGCW-V13GK

High-conductivity 12 W/mK thermal pad, 80 × 40 × 3.0 mm, non-conductive and non-curing for GPUs, laptops and dense PCBs

Option 80 x 40 x 3.0 mm

  • 12 W/mK thermal conductivity moves heat fast from hot components
  • Soft 3.0 mm pad fills uneven gaps on PCBs and memory ICs
  • Non-electrically conductive material prevents short circuits on dense boards
  • 80×40 mm sheet covers large GPU and laptop surfaces in one piece
  • Non-corrosive, non-curing and non-toxic formula stays stable over time

Purpose-built thermal pad

The GP-Extreme is a 12 W/mK thermal pad cut to 80 × 40 mm and 3.0 mm thick. It targets builders and technicians who need a soft, non-conductive interface for uneven PCB surfaces on graphics cards, laptops, consoles and dense SMD assemblies. The material is non-corrosive, non-hardening and non-toxic.

Capacity and headroom

At 12 W/mK the pad moves heat efficiently across typical MOSFET, memory IC and micro-controller heights, filling gaps up to its 3.0 mm thickness without excessive pressure. It runs out of headroom when the stack height exceeds that thickness or when a higher-conductivity paste is required for direct die contact.

Thickness selector

This specific SKU is the 3.0 mm variant; the same series also exists in 0.5, 1.0, 1.5 and 2.0 mm. Choose the thickness that matches the exact gap between component and heatsink — using a pad that is too thick or too thin will degrade thermal transfer.

Besonderheiten

  • 12 W/mK thermal conductivity moves heat fast from hot components
  • Soft 3.0 mm pad fills uneven gaps on PCBs and memory ICs
  • Non-electrically conductive material prevents short circuits on dense boards
  • 80×40 mm sheet covers large GPU and laptop surfaces in one piece
  • Non-corrosive, non-curing and non-toxic formula stays stable over time

Technische Daten

BrandGELID Solutions

Andere Versionen dieses Modells

4 weitere aus dieser Serie

Gleiche Familie, unterschiedlicher Speicher, Kühler oder Takt — vergleichen Sie, bevor Sie sich entscheiden.

Fragen zu diesem Artikel

Will the 3.0 mm thickness work with the uneven surface of my older GPU VRM heatsink?

The 3.0 mm pad is soft and compressible, designed to fill gaps on uneven PCB surfaces such as VRM modules, MOSFETs and memory ICs for full contact.

How can I verify the 12 W/mK thermal conductivity is performing after installation?

Monitor component temperatures under load; a drop compared to the previous interface material indicates the pad is conducting heat as specified.

Does the 80×40 mm sheet include any protective film or tools, or must I buy them separately?

The pack contains one 80×40 mm thermal pad only; no protective film, applicator or additional accessories are included.

Ebenfalls in dieser Kategorie

Kunden haben diese ebenfalls verglichen

Gleiche Abteilung, gleiche Kasse — acht Kryptowährungen und ein für 30 Minuten fixierter Kurs.