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Light blue rectangular thermal pad 80 by 40 by 2.0 mm

GELID SOLUTIONS

GELID SOLUTIONS GP-Extreme 12W Thermal Pad 80x40x2.0mm

SKU CH-XWJH-30JYK

A 12 W/mK thermal pad measuring 80 × 40 × 2.0 mm that fills gaps on GPUs, laptops and consoles without conducting electricity

Option 80 x 40 x 2.0 mm

  • 12 W/mK thermal conductivity for superior heat transfer
  • Non-electrically conductive pad prevents short circuits
  • Soft 2.0 mm thickness conforms to uneven surfaces
  • 80×40 mm dimensions cover large PCB areas
  • Non-corrosive, non-hardening material stays effective over time

Thermal pad for uneven PCB surfaces

The GP-Extreme is a 12 W/mK thermal pad built for components that sit at different heights on a board. It suits graphics cards, laptops, consoles and dense microcontroller layouts where a flat paste cannot bridge the gaps. The material is non-electrically conductive, non-corrosive, non-curing and non-toxic. One sheet measures 80 by 40 millimetres and is 2.0 millimetres thick.

Soft silicone sheet bridges height differences

The pad stays pliable so it conforms to MOSFETs, memory ICs and analog chips without hardening over time. Because it does not conduct electricity there is no risk of shorting adjacent pins if the pad shifts. The 80 by 40 millimetre rectangle covers large VRM arrays or memory banks in a single piece. Installation is a matter of peeling the liner and pressing the pad into place.

12 W/mK conductivity decides the fit

Thermal conductivity of 12 W/mK is the single figure that tells you whether this pad can move enough heat for your target component. If the part you are cooling demands a higher rating you will need a different material. Thinner options of 0.5, 1.0 and 1.5 millimetres plus a 3.0 millimetre version exist for other gap sizes.

Besonderheiten

  • 12 W/mK thermal conductivity for superior heat transfer
  • Non-electrically conductive pad prevents short circuits
  • Soft 2.0 mm thickness conforms to uneven surfaces
  • 80×40 mm dimensions cover large PCB areas
  • Non-corrosive, non-hardening material stays effective over time

Technische Daten

BrandGELID Solutions

Andere Versionen dieses Modells

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Fragen zu diesem Artikel

How much heat can the 12 W/mK thermal pad actually move across the gap?

The pad conducts at 12 W/mK, so heat flow scales with contact area and temperature difference; it fills uneven surfaces up to 2.0 mm thick without hardening.

Will the 80×40 mm sheet cover my GPU memory modules and VRM area?

The pad measures 80 mm by 40 mm and is 2.0 mm thick, sized for large PCB surfaces such as graphics cards, laptops and consoles.

Do I need to spread paste or can I just place the pad on the chip?

Peel the protective film, lay the soft pad directly on the component, then mount the heatsink — no spreading, curing or cleaning of paste is required.

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