Thermal Grizzly
Thermal Grizzly TG-MP8-120-20-30-1R Minus Pad 8 chipset cooling 120x20x3.0mm
High-conductivity thermal pad measuring 120x20x3.0 mm with 8.0 W/mK rating for chipset and memory cooling
- Thermal conductivity of 8.0 W/mK moves heat efficiently
- Operates from -100 °C to +250 °C for extreme environments
- 120 mm by 20 mm by 3.0 mm fits chipset and memory modules
- Light brown pad is non-conductive and easy to position
Thermal Pad for Chipset Cooling
The Thermal Grizzly Minus Pad 8 is a thermal interface pad designed for memory modules and chipset components. It measures 120 mm by 20 mm with a thickness of 3.0 mm. The pad suits builders fitting a single sheet onto compact board areas.
Thermal Conductivity 8.0 W/mK
This pad delivers a thermal conductivity of 8.0 W/mK to move heat away from the component. It operates continuously between -100 °C and +250 °C without degrading. The light brown material is non-electrically conductive and requires no curing time. Buyers needing a thinner or thicker profile for a different gap must select another variant.
Besonderheiten
- Thermal conductivity of 8.0 W/mK moves heat efficiently
- Operates from -100 °C to +250 °C for extreme environments
- 120 mm by 20 mm by 3.0 mm fits chipset and memory modules
- Light brown pad is non-conductive and easy to position
Technische Daten
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Fragen zu diesem Artikel
What does the 8.0 W/mK conductivity mean when the pad is installed on a chipset?
The 8.0 W/mK rating indicates how efficiently heat moves through the pad; in a real machine it reduces the thermal resistance between the chipset and heatsink, lowering component temperature under load.
How does the 3.0 mm thickness affect the contact pressure and gap filling?
At 3.0 mm the pad compresses to fill uneven surfaces between chipset and cooler, maintaining consistent pressure across the 120 x 20 mm area without exceeding the operating range of -100°C to +250°C.
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