Hyväksymme kryptoa — hallussasi olevat kolikot voivat näin ostaa oikeaa laitteistoa.Maksa kryptolla, käytä se oikeaan laitteistoon. Ilmainen vakuutettu toimitus maailmanlaajuisesti yli 399 $. Neutraalit, tuotemerkittömät ulkopakkaukset, lähetetään Saksasta.Ilmainen vakuutettu toimitus yli 399 $. Kurssisi lukitaan 30 minuutiksi heti, kun kassa avautuu.Kurssi lukittu 30 minuutiksi. Jokainen tuote on sinetöity, sen sarjanumero on tarkistettu, ja sillä on 24 kuukauden takuu.Sinetöity, 24 kuukauden takuu.

Seuratut tuotteet Kirjaudu sisään
Grey thermal pad sheet 80 by 40 by 0.5 mm

GELID SOLUTIONS

GELID SOLUTIONS GP-Extreme 12W Thermal Pad 80x40x0.5mm

SKU CH-J7YM-EG3C6

High-conductivity 12 W/mK thermal pad measuring 80×40×0.5 mm for memory ICs, MOSFETs and other SMD components

Option 80 x 40 x 0.5 mm

  • 12 W/mK thermal conductivity transfers heat efficiently from memory and chipset components
  • 5 mm thickness conforms to uneven PCB surfaces for reliable contact
  • Non-electrically conductive material prevents short circuits on dense boards
  • 80 × 40 mm sheet covers large VGA card or laptop heatsink areas
  • Soft, non-curing pad installs easily without hardening over time

Thermal pad for uneven PCB surfaces

The GELID SOLUTIONS GP-Extreme is a 12 W/mK thermal pad measuring 80 by 40 by 0.5 mm. It targets builders who need reliable heat transfer between a heatsink and components that sit at different heights on a circuit board. The material is non-electrically conductive, non-corrosive, non-curing and non-toxic. It suits graphics cards, laptops, consoles and dense SMD layouts.

Softness and pre-cut dimensions simplify

The pad’s softness lets it conform to surface irregularities without excessive pressure, filling gaps that firmer pads would leave. Its 80 by 40 mm footprint matches larger PCB areas so users can apply a single piece instead of cutting smaller strips. No adhesive or curing time is required; the pad stays pliable and can be repositioned during assembly.

0.5 mm thickness decides fit for tight clearances

This variant is 0.5 mm thick; the same series also exists in 1.0, 1.5, 2.0 and 3.0 mm options. Choose this thickness only when the component-to-heatsink gap measures close to half a millimetre. Buyers needing to bridge larger gaps should select a thicker pad from the same range.

Kohokohdat

  • 12 W/mK thermal conductivity transfers heat efficiently from memory and chipset components
  • 5 mm thickness conforms to uneven PCB surfaces for reliable contact
  • Non-electrically conductive material prevents short circuits on dense boards
  • 80 × 40 mm sheet covers large VGA card or laptop heatsink areas
  • Soft, non-curing pad installs easily without hardening over time

Tekniset tiedot

BrandGELID Solutions

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Kysymyksiä tästä tuotteesta

When will the 0.5 mm GP-Extreme pad need replacing?

The pad is non-hardening and non-curing, so it does not degrade on a fixed schedule. Replace only if the cooler is removed or the pad is physically damaged.

What limits heat transfer during long sessions with this 12 W/mK pad?

The 12 W/mK conductivity and 0.5 mm thickness set the steady-state thermal resistance; the pad itself does not saturate or throttle.

Does the GP-Extreme pad generate noise or extra heat when used continuously?

It is a passive silicone pad with no moving parts, so it produces zero noise and adds no heat beyond conducting it from the component to the heatsink.

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