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Three green PCBs with dual 16-pin footprints and .1 inch hole rows

Adafruit

Adafruit SMT Breakout PCB SOIC-16 TSSOP-16 3 pack

SKU CH-7P0S-R5DQV

Three breakout PCBs adapt 16-pin SOIC or TSSOP chips to dual rows of .1-inch spaced holes with .6-inch row spacing

  • TypePrototyping Products
  • Three identical PCBs let you prototype multiple circuits at once
  • Each board accepts both SOIC-16 and TSSOP-16 packages for flexible chip choice
  • 6 inch row spacing matches standard solderless breadboard pitch
  • One side routes 16 TSSOP pins to two rows of 0.1 inch holes
  • Reverse side routes 16 SOIC pins to the same 0.1 inch hole pattern

Prototyping PCBs for SOIC and TSSOP

This pack contains three identical printed circuit boards designed for surface-mount prototyping. Each board accepts either a 16-pin SOIC or a 16-pin TSSOP device. Traces route the pins to two rows of 0.1" spaced holes for breadboard use. The boards are new and ready for immediate assembly.

Replacing adapter boards and dead-bug wiring

These PCBs replace makeshift adapter boards or hand-wired dead-bug prototypes for 16-pin packages. The dual-footprint layout means one board design covers both SOIC and TSSOP footprints. The jump is worth it when you need reliable 0.1" header access for repeated breadboard insertion and removal during development.

Engineers prototyping 16-pin surface-mount parts

Suits engineers and hobbyists prototyping with 16-pin SOIC or TSSOP packages who need quick breadboard compatibility. Not for designs requiring pin counts other than 16 or packages such as QFP or BGA. Buyers who need mounted headers or a different hole pitch should look at other options.

Punti di forza

  • Three identical PCBs let you prototype multiple circuits at once
  • Each board accepts both SOIC-16 and TSSOP-16 packages for flexible chip choice
  • 6 inch row spacing matches standard solderless breadboard pitch
  • One side routes 16 TSSOP pins to two rows of 0.1 inch holes
  • Reverse side routes 16 SOIC pins to the same 0.1 inch hole pattern

Caratteristiche tecniche

TypePrototyping Products

Domande su questo articolo

Will the 0.6" row spacing fit a standard .1" breadboard?

Yes, each side routes to two rows of .1" holes spaced 0.6" apart, matching common solderless breadboards.

Which side do I solder a TSSOP-16 chip onto for correct pin numbering?

Use the side marked 16-TSSOP; the opposite side is for SOIC-16 and would misalign the pinout.

Can I re-use a board if I desolder the chip later?

The pads are standard FR4 copper; careful desoldering with flux and braid usually leaves them intact for a new chip.

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