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Square green ceramic processor with gold contact pads and silver metal heat spreader, SP3 socket form factor

AMD

AMD EPYC 75F3 2.95 GHz 256MB L3 280W server processor

SKU CH-DTZ3-X1VJV

32-core server CPU with 2.95 GHz base clock, 256 MB L3 cache and 128 PCIe 4.0 lanes for high-throughput workloads

  • 32 cores accelerate multi-threaded workloads
  • 95 GHz base clock sustains high-frequency compute
  • 256 MB L3 cache reduces memory latency
  • PCIe 4.0 x128 lanes maximise I/O throughput

AMD EPYC 75F3 32-core server processor

The AMD EPYC 75F3 is a 32-core server processor built on the Milan architecture. It operates at a 2.95 GHz base clock with 256 MB of L3 cache. The CPU supports PCIe 4.0 with up to 128 lanes for high-speed I/O connectivity. It uses the SP3 socket and has a 280 W thermal design power.

Ideal for single-threaded server workloads

This processor suits users who need high per-core frequency for latency-sensitive applications. Buyers who want more cores for parallel throughput should look at other models. It is not for systems that lack SP3 socket infrastructure or adequate 280 W cooling capacity. OEM packaging means no retail box or bundled cooler is included.

Punti di forza

  • 32 cores accelerate multi-threaded workloads
  • 95 GHz base clock sustains high-frequency compute
  • 256 MB L3 cache reduces memory latency
  • PCIe 4.0 x128 lanes maximise I/O throughput

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Domande su questo articolo

How many PCIe 4.0 lanes does the EPYC 75F3 expose for sustained I/O workloads?

The processor provides 128 lanes of PCIe 4.0, giving ample bandwidth for storage and networking under continuous load.

What is the thermal design power that determines cooling requirements for all-day operation?

The EPYC 75F3 carries a 280 W TDP, so the cooling solution must handle that heat output continuously.

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