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Silver 1U rack server front with eight 2.5-inch drive bays and bezel

DELL

DELL PowerEdge R640 1U Rack Server 2x Xeon Gold 6134 3.2GHz 512GB DDR4 8x 2.4TB SAS H730P

SKU CH-46RM-16XSN

Dual 3.2 GHz Xeon Gold 6134 processors with 512 GB DDR4 ECC memory and eight 2.4 TB SAS drives on a PERC H730P controller in a 1U rack server

  • TypeRack
  • Rack Height1U
  • Redundant Hot-swap PowerYes
  • CPU TypeIntel Xeon
  • CPU Speed3.20 GHz
  • CPU SocketLGA 3647
  • Dual Xeon Gold 6134 CPUs deliver 3.2 GHz base with 3.7 GHz turbo for compute density
  • 512 GB DDR4 2666 MHz ECC memory across 16 modules supports large workloads
  • PERC H730P 2 GB controller enables RAID 0, 1, 5, 6, 10, 50, 60 with battery backup
  • Eight 2.4 TB 10K SAS drives provide high-capacity, low-latency storage in 2.5" bays
  • iDRAC9 Enterprise plus quad-port 1 GbE and 10 Gb SFP+ networking for remote management and throughput

Dense dual-socket 1U server

The Dell PowerEdge R640 is a 1U rack server built for dense scale-out data centre computing. It ships with two Intel Xeon Gold 6134 processors, each running at 3.2 GHz with eight cores and a 3.7 GHz turbo frequency. The system includes 512 GB of DDR4 registered ECC memory across 16 modules and a PERC H730P controller with 2 GB cache. Eight 2.4 TB 10K SAS drives and quad-port networking with two 10 Gb SFP+ and two 1 GbE ports complete the configuration.

Virtualisation hosts needing maximum core density

This server suits organisations consolidating virtual machines or running memory-intensive databases within a single rack unit. The 24 DIMM slots support up to 3 TB of DDR4, and the dual 750 W platinum power supplies provide redundancy. Buyers who need GPU acceleration, more than two processor sockets or storage interfaces beyond SAS and SATA should evaluate alternative platforms.

512 GB DDR4 registered ECC memory installed

The installed 512 GB of DDR4 2666 MHz registered ECC memory across 16 slots determines immediate capacity for large working sets. With 24 total slots and a 3 TB maximum, expansion headroom is significant but requires compatible registered ECC modules. Verify that your workload fits within the current 512 GB or plan for additional DDR4 DIMMs.

Punti di forza

  • Dual Xeon Gold 6134 CPUs deliver 3.2 GHz base with 3.7 GHz turbo for compute density
  • 512 GB DDR4 2666 MHz ECC memory across 16 modules supports large workloads
  • PERC H730P 2 GB controller enables RAID 0, 1, 5, 6, 10, 50, 60 with battery backup
  • Eight 2.4 TB 10K SAS drives provide high-capacity, low-latency storage in 2.5" bays
  • iDRAC9 Enterprise plus quad-port 1 GbE and 10 Gb SFP+ networking for remote management and throughput

Caratteristiche tecniche

BrandDELL
SeriesPowerEdge R640
ModelR640
TypeRack
Rack Height1U
Redundant Hot-swap PowerYes
CPU TypeIntel Xeon
CPU Speed3.20 GHz
CPU SocketLGA 3647
Number of CPU Cores8-Core Processor
# of Processors Installed2
MAX Processors2
ChipsetIntel C620
Installed Memory Size512GB
Memory TypeDDR4
Max Memory Capacity3TB
Number of Memory Slots24
Storage ControllerDell Perc H730P 2GB Controller
HDD InterfaceSAS
SSD (Installed)No
Raid LevelRAID 0/1/5/6/10/50/60
GPU TypeMatrox G200
Video Memory8MB
Ethernet ControllerDell Intel X520/I350 Quad Port 2x 1GbE 2x 10Gb SFP+ Network Daughter Card
LAN Ports4 x Ports
Expansion SlotsUp to 3 PCIe Gen 3 slots all x16
Management PortRJ 45
Operating SystemNo
Features8 x 2.5" SATA/SAS Hot-Plug Drive Bays

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Domande su questo articolo

How do I install the eight 2.4 TB SAS drives into the front bays, and which step is often missed?

Slide each 2.5" drive into the hot-swap bay until the latch clicks, then use the PERC H730P BIOS utility to create the desired RAID level before the OS sees the volumes.

What maintenance will the PERC H730P controller battery need over time?

The controller includes a 2 GB cache battery; plan to replace it when iDRAC 9 Enterprise reports a degraded or failed battery status.

Which limit appears first when both Xeon Gold 6134 CPUs run at 3.7 GHz turbo under sustained load?

The dual 750 W platinum power supplies set the thermal and power ceiling before the 1U chassis airflow becomes the bottleneck.

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