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Dell PowerEdge R730 2U rack server silver front with eight 2.5 inch drive bays

DELL

DELL PowerEdge R730 2U 2x E5-2630v3 2.4GHz 128GB DDR4 H330 8x 2.5

SKU CH-AN3D-3SV8B

2U rack server with dual 8-core Xeon CPUs, 128 GB DDR4, H330 RAID controller and eight 2.5-inch hot-plug bays

  • TypeRack
  • Rack Height2U
  • Redundant Hot-swap PowerYes
  • CPU TypeDual Intel Xeon
  • MAX Processors2
  • ChipsetIntel C610

Installed Memory Size 128GB

HDD None

  • Dual Xeon E5-2630v3 CPUs deliver 32 virtual cores for parallel workloads
  • 128GB DDR4 memory installed across 24 DIMM slots for large datasets
  • H330 12Gbps RAID controller supports RAID 0/1/5/10/50/60 for flexible storage
  • Dual 750W redundant power supplies keep the server running during a failure
  • Eight 2.5" hot-plug bays allow drive changes without downtime

Dual-socket Xeon server for virtualisation hosts

The PowerEdge R730 fits into a 2U rack space and ships with two E5-2630v3 eight-core processors running at 2.4GHz. A total of 128GB of DDR4 memory occupies the 24 DIMM slots, reaching the installed maximum. The H330 controller manages up to eight 2.5-inch hot-plug SAS or SATA drives in RAID 0/1/5/10/50/60 configurations.

Redundant 750W supplies and iDRAC8 remote management

Dual hot-swap power supplies provide redundancy without shutting the system down. The integrated iDRAC8 with Lifecycle Controller gives out-of-band access for firmware updates, hardware monitoring and virtual console sessions. A Matrox G200 video chip handles basic display output while the four onboard 1GbE ports handle production traffic.

No drives or trays included — add your own storage

The chassis accepts up to eight 2.5-inch drives but ships empty, so capacity and performance depend entirely on the SAS or SATA media you install. Seven PCIe 3.0 slots plus a dedicated PERC slot remain available for additional controllers, networking cards or accelerators. A DVD-ROM drive and a power cable are the only peripherals supplied.

Punti di forza

  • Dual Xeon E5-2630v3 CPUs deliver 32 virtual cores for parallel workloads
  • 128GB DDR4 memory installed across 24 DIMM slots for large datasets
  • H330 12Gbps RAID controller supports RAID 0/1/5/10/50/60 for flexible storage
  • Dual 750W redundant power supplies keep the server running during a failure
  • Eight 2.5" hot-plug bays allow drive changes without downtime

Caratteristiche tecniche

BrandDELL
SeriesPowerEdge
ModelPowerEdge R730
TypeRack
Rack Height2U
Redundant Hot-swap PowerYes
CPU TypeDual Intel Xeon
MAX Processors2
ChipsetIntel C610
Installed Memory Size128GB
Memory TypeDDR4
Max Memory Capacity128GB
Memory Features24 DIMM slots, 12 per processor. (4GB/8GB/16GB/32GB/64GB/128GB DDR4 up to 2400MT/s, actual memory speed dependent on the processor capability)
Number of Memory Slots24
Storage ControllerDell Perc H330 Controller
SSD (Installed)No
Raid LevelRAID 0/1/5/10/50/60
Max HDD Capacity64TB
Media DrivesDVD ROM
GPU TypeMatrox G200
Video Memory8MB
Remote ManagementiDRAC8 with Lifecycle Controller, iDRAC8 Express (default), iDRAC8 Enterprise (upgrade) 8GB vFlash media (upgrade), 16GB vFlash media (upgrade)
LAN Ports4 x Ports
Expansion SlotsUp to 7 x PCIe 3.0 plus dedicated PERC slot
Operating SystemNo
Compatible/Certified OSMicrosoft Windows Small Business Server 2011/2008, Microsoft Windows Server 2008 R2 SP1/SP2, Microsoft Windows HPC Server 2008 R2, Novell SUSE Linux Enterprise Server, Red Hat Enterprise Linux, Oracle Solaris
Weight70.0000LBS

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Domande su questo articolo

How do I install the drives and what step is often missed?

Slide each 2.5 inch SAS or SATA drive into a hot-plug bay until the latch clicks; the step people miss is creating the virtual disk in the H330 RAID BIOS before the OS sees any volume.

What will need replacement first under continuous operation?

The 750 watt redundant power supplies are the first field-replaceable units to wear out; fans and the iDRAC battery follow later.

What limit appears first during sustained heavy workloads?

The two E5-2630 v3 CPUs hit their 2.4 GHz base clock ceiling and thermal envelope before memory or PCIe 3.0 bandwidth become bottlenecks.

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