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Green circuit board SODIMM module with black memory chips and gold edge connector

NEMIX RAM

NEMIX RAM 32GB DDR4 2666 CL19 2Rx8 260-Pin SODIMM memory upgrade

SKU CH-0S3S-FXR6X

32GB DDR4 2666 CL19 SODIMM module for Samsung laptops and all-in-one PCs

  • Capacity32GB
  • SpeedDDR4 2666 (PC4 21300)
  • ECCNo
  • Buffered/RegisteredUnbuffered
  • ChipsetMajor OEM Samsung, Micron, Hynix
  • Voltage1.20V
  • 32 GB single module doubles laptop memory capacity
  • DDR4 2666 speed matches Samsung factory specification
  • CL19 latency with 1.2 V keeps power draw low
  • 2Rx8 organisation on 260-pin SODIMM fits Samsung M471A4G43MB1-CTD
  • Major OEM Samsung Micron Hynix chips validated under load

Samsung-compatible DDR4 SODIMM upgrade

This 32 GB DDR4 2666 CL19 module is built for Samsung laptops and all-in-one PCs that accept 260-pin SODIMMs. It delivers a straight-forward capacity increase for owners of those systems who need more memory for multitasking or heavier workloads.

Single-slot 2Rx8 layout keeps one socket free

The 2Rx8 organisation packs the full 32 GB into a single stick, leaving any second SODIMM slot open for future expansion. No heat spreader means the module fits tight chassis clearances where taller sticks would not seat correctly.

1.20 V operation limits heat and power draw

Running at the standard DDR4 voltage, the unbuffered non-ECC stick adds minimal thermal load to a compact laptop or AIO enclosure. Fan noise and battery impact stay close to stock levels during typical productivity use.

Punti di forza

  • 32 GB single module doubles laptop memory capacity
  • DDR4 2666 speed matches Samsung factory specification
  • CL19 latency with 1.2 V keeps power draw low
  • 2Rx8 organisation on 260-pin SODIMM fits Samsung M471A4G43MB1-CTD
  • Major OEM Samsung Micron Hynix chips validated under load

Caratteristiche tecniche

BrandNEMIX RAM
SeriesSamsung Laptop, AIO All-in-One PC Compatible Series Memory
ModelSamsung DDR4 2666MHZ Non-ECC Unbuffered SODIMM
Part NumberMS21300-328K1
Capacity32GB
SpeedDDR4 2666 (PC4 21300)
ECCNo
Buffered/RegisteredUnbuffered
ChipsetMajor OEM Samsung, Micron, Hynix
Voltage1.20V
Compatible SystemSamsung
CAS LatencyCL19
Heat SpreaderNo
Type260-Pin DDR4 SODIMM
Rank2Rx8
FeaturesDDR4 Non-ECC Unbuffered SODIMM Motherboard Compatible
Package Content32GB (1X32GB) DDR4 2666MHZ PC4-21300 2Rx8 1.2V CL19 260-PIN Non-ECC Unbuffered SODIMM

Domande su questo articolo

Will the CL19 latency become a bottleneck during sustained workloads?

CL19 is the rated CAS latency for this DDR4 2666 module; it remains constant under load and does not increase with sustained use.

How much heat and power does a 32 GB 1.2 V SODIMM produce when running all day?

The module operates at 1.20 V with no heat spreader; DDR4 SODIMMs at this voltage typically stay cool and draw only a few watts under continuous operation.

What must my Samsung laptop already have to accept this 260-pin 2Rx8 upgrade?

Your system needs a free DDR4 SODIMM slot that supports 2666 MT/s PC4-21300 non-ECC unbuffered memory and can address a 32 GB 2Rx8 module.

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